Inventor
HUANG TAI-YUAN
TW11 patents
⚠️ This page may combine multiple inventors who share the name “HUANG TAI-YUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
7 patentsUS7253508B2Aug 7, 2007
Semiconductor package with a flip chip on a solder-resist leadframe
ADVANCED SEMICONDUCTOR ENG24 citations92
US7466031B2Dec 16, 2008
Structure and method of forming metal buffering layer
ADVANCED SEMICONDUCTOR ENG10 citations82
US7614888B2Nov 10, 2009
Flip chip package process
ADVANCED SEMICONDUCTOR ENG7 citations72
US9891048B2Feb 13, 2018
Measurement equipment
ADVANCED SEMICONDUCTOR ENG4 citations69
US7071544B2Jul 4, 2006
Wafer level assembly package
ADVANCED SEMICONDUCTOR ENG0 citations49
US10222209B2Mar 5, 2019
Measurement equipment
ADVANCED SEMICONDUCTOR ENG0 citations48
US10344383B2Jul 9, 2019
Semiconductor package device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations44
PHISON ELECTRONICS CORP
2 patentsUS11467758B2Oct 11, 2022
Data writing method using different programming modes based on the number of available physical erasing units, memory control circuit unit and memory storage device
PHISON ELECTRONICS CORP5 citations71
US10871914B2Dec 22, 2020
Memory management method, memory storage device and memory control circuit unit
PHISON ELECTRONICS CORP1 citations54