Inventor

CHIANG TSUNG-HSIEN

TW52 patents

⚠️ This page may combine multiple inventors who share the name “CHIANG TSUNG-HSIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHIANG TSUNG-HSIEN

TAIWAN SEMICONDUCTOR MFG CO LTD

Package structure and method of forming the same

Sensor package and method

Integrated fan-out package and method of fabricating the same

Wafer level embedded heat spreader

Package structure and method of forming the same

Sensor package and method

Semiconductor package and method

Chip package with fan-out structure

Package structure having redistribution layer structures

Semiconductor package and manufacturing method thereof

Semiconductor package and method of manufacturing semiconductor package

Bonded structures for package and substrate

Semiconductor package and method

Chip package with fan-out structure

Bonded structures for package and substrate

Integrated fan-out package

Method for forming chip package involving cutting process

Bonded structures for package and substrate

Interconnect structures for wafer level package and methods of forming same

Integrated circuit package and method

Semiconductor packages

Thermally enhanced package-on-package (PoP)

Package structure and method of forming the same

Package structure and method of forming the same

Semiconductor package

Sensor packages

Package structure with fan-out feature

Formation method of chip package with fan-out structure

Integrated circuit package and method

Method of manufacturing semiconductor package

Wafer level embedded heat spreader

Method of fabricating semiconductor package

Method of fabricating semiconductor package

Semiconductor package and method of fabricating the same

Package structure

Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same

InFO coil structure and methods of manufacturing same

Package structure having redistribution layer structures

Info coil structure and methods of manufacturing same

Wafer level embedded heat spreader

Interconnect structures for wafer level package and methods of forming same

Staggered metal mesh on backside of device die and method forming same

TAIWAN SEMICONDUCTOR MFG

Bonded structures for package and substrate

Bonded structures for package and substrate

Bonded structures for package and substrate

LIU SHOW-WEN

Precursor used for labeling hepatorcyte receptor and containing trisaccharide and diamide demercaptide ligand, method for preparing the same, radiotracer and pharmaceutical composition of the same

Radiotracer precursor and method for preparing the same

KUO CHANG-HSIN

Crossed-roller bearing

CHIANG TSUNG-HSIEN

Linear transmission assembly having lubricant recovery module

ATOMIC ENERGY COUNCIL—INST OF NUCLEAR ENERGY RES

Radiotracer precursor BANI for imaging of hypoxic tissue, radiotracer, and method for preparing the same