Inventor
FENG HSIANG-AN
TW16 patents
⚠️ This page may combine multiple inventors who share the name “FENG HSIANG-AN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INGENTEC CORP
11 patentsUS12487188B2Dec 2, 2025
Wafer defect analyzing device and wafer defect analyzing method
INGENTEC CORP0 citations60
US11791439B2Oct 17, 2023
Magnetic light-emitting structure
INGENTEC CORP0 citations60
US11621368B2Apr 4, 2023
Magnetic light-emitting structure and fabrication method for manufacturing a magnetic light-emitting element
INGENTEC CORP0 citations60
US11508872B2Nov 22, 2022
Alignment module for transferring a magnetic light-emitting die and alignment method thereof
INGENTEC CORP1 citations60
US11769861B2Sep 26, 2023
Light-emitting diode packaging structure and method for fabricating the same
INGENTEC CORP0 citations50
US10622509B2Apr 14, 2020
Vertical type light emitting diode die and method for fabricating the same
INGENTEC CORP0 citations50
US10622510B2Apr 14, 2020
Vertical type light emitting diode die and method for fabricating the same
INGENTEC CORP0 citations50
US12593733B2Mar 31, 2026
Vertical light emitting diode die packaging method
INGENTEC CORP0 citations48
US12418011B2Sep 16, 2025
Bonding and transferring method for die package structures
INGENTEC CORP0 citations48
US12417964B2Sep 16, 2025
Via-filling method of through-glass via substrate
INGENTEC CORP0 citations48
US12489093B2Dec 2, 2025
Magnetic LED die transferring device and magnetic LED die transferring method
INGENTEC CORP0 citations45