Inventor · disambiguated record
Kojiro Abe
Also filed as: ABE KOJIRO
11 granted patents·2 pending applications·358 citations·filing 1999–2013
91Inventor score
Files withMITSUBISHI GAS CHEMICAL CO5SHIMADA KENJI2TOKYO ELECTRON LTD2YAGUCHI KAZUYOSHI2MITSUBISHI GAS CHEMICALS CO IN1
Top patents by PatentIndex Score
13 records- 0195US6372410B1Resist stripping compositionMITSUBISHI GAS CHEMICAL CO·Filed 2000·Granted Apr 16, 2002·107 cites·23 claims
- 0294US6323169B1Resist stripping composition and process for stripping resistMITSUBISHI GAS CHEMICAL CO·Filed 2000·Granted Nov 27, 2001·94 cites·16 claims
- 0387US7572758B2Cleaning liquid and cleaning methodMITSUBISHI GAS CHEMICAL CO·Filed 2005·Granted Aug 11, 2009·13 cites·11 claims
- 0487US6514352B2Cleaning method using an oxidizing agent, chelating agent and fluorine compoundTOKYO ELECTRON LTD·Filed 2001·Granted Feb 4, 2003·43 cites·18 claims
- 0585US7998914B2Cleaning solution for semiconductor device or display device, and cleaning methodMITSUBISHI GAS CHEMICAL CO·Filed 2006·Granted Aug 16, 2011·10 cites·14 claims
- 0680US6265309B1Cleaning agent for use in producing semiconductor devices and process for producing semiconductor devices using the sameMITSUBISHI GAS CHEMICALS CO IN·Filed 1999·Granted Jul 24, 2001·78 cites·24 claims
- 0773US8802608B2Composition for cleaning and rust prevention and process for producing semiconductor element or display elementSHIMADA KENJI·Filed 2008·Granted Aug 12, 2014·4 cites·6 claims
- 0870US8859411B2Method for producing transistorSHIMADA KENJI·Filed 2011·Granted Oct 14, 2014·2 cites·16 claims
- 0963US9587208B2Cleaning liquid composition, method for cleaning semiconductor element, and method for manufacturing semiconductor elementMITSUBISHI GAS CHEMICAL CO·Filed 2013·Granted Mar 7, 2017·1 cites·6 claims
- 1057US6875288B2Cleaning agent and cleaning methodTOKYO ELECTRON LTD·Filed 2001·Granted Apr 5, 2005·6 cites·18 claims
- 1138US2009246967A1Semiconductor surface treatment agentYAGUCHI KAZUYOSHI·Filed 2006·Application pending·0 cites
- 1237US8658053B2Etching composition for metal material and method for manufacturing semiconductor device by using sameYAGUCHI KAZUYOSHI·Filed 2006·Granted Feb 25, 2014·0 cites·16 claims
- 1336US2004009883A1Resist stripping compositionFiled 2003·Application pending·0 cites
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