Inventor · disambiguated record

Pao-Chia Pan

Also filed as: PAN PAO-CHIA

1 granted patent·4 citations·filing 2018–2018

23Inventor score

Technology areasH10P

Files withVERSUM MAT US LLC1

Top patents by PatentIndex Score

1 record

0179US11401441B2Chemical mechanical planarization (CMP) composition and methods therefore for copper and through silica via (TSV) applicationsVERSUM MAT US LLC·Filed 2018·Granted Aug 2, 2022·4 cites·2 claims

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