Inventor

LEE HEESOO

KR87 patents

⚠️ This page may combine multiple inventors who share the name “LEE HEESOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE HEESOO

STATS CHIPPAC PTE LTD

System-in-package with double-sided molding

Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same

Molded laser package with electromagnetic interference shield and method of making

Semiconductor device and method of forming a 3D interposer system-in-package module

Semiconductor device and method of forming a 3D integrated system-in-package module

Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same

System-in-package with double-sided molding

Semiconductor device and method of forming an integrated SIP module with embedded inductor or package

Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereof

Selective EMI shielding using preformed mask

Semiconductor device and method of providing high density component spacing

System-in-package with double-sided molding

Selective EMI shielding using preformed mask

Semiconductor device and method of forming protrusion E-bar for 3D SIP

Semiconductor device and method for advanced thermal dissipation

Method and device for reducing metal burrs when sawing semiconductor packages

Semiconductor device and method of forming a 3D interposer system-in-package module

Method and device for reducing metal burrs when sawing semiconductor packages

Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same

Semiconductor device and method of embedding circuit pattern in encapsulant for SIP module

Method and device for reducing metal burrs when sawing semiconductor packages

Molded laser package with electromagnetic interference shield and method of making

Molded laser package with electromagnetic interference shield and method of making

Semiconductor device and method of forming an integrated SiP module with embedded inductor or package

Cooling device and process for cooling double-sided SiP devices during sputtering

ELECTRONICS & TELECOMMUNICATIONS RES INST

Carrier aggregation in wireless communication systems

Method and apparatus for transmitting scrambled data by user equipment

Carrier aggregation in wireless communication systems

Carrier aggregation in wireless communication systems

Method and apparatus for transmitting channel information based on machine learning

Method and apparatus for improving handover performance in communication system

Method and apparatus for conditional handover operation in communication system

Method and apparatus for codebook design in communication system

Beam search method and apparatus in smart repeater system

KOREA ELECTRONICS TELECOMM

Carrier aggregation in wireless communication systems

Carrier aggregation in wireless communication system

Carrier aggregation in wireless communications systems

Transmitter, receiver and method for controlling multiple input multiple output system

SEO BANGWON

Cooperative reception diversity apparatus and method based on signal point rearrangement or superposition modulation in relay system

Method and system for operating cooperative receiving diversity scheme and selective cooperative relaying

Method and apparatus for determining reporting period of channel quality information in multi-carrier wireless system

LEE HEESOO

Apparatus and method for transmitting and receiving data in wireless communication system using relay

Transmitter/receiver for controlling multiuser multiple input multiple output system and method thereof

Apparatus and method of transmitting and receiving reception acknowledgment signal in mobile communication system

JCET STATS CHIPPAC KOREA LTD

Semiconductor device and method of forming conductive structure for EMI shielding and heat dissipation

Integrated antenna-in-package structure

AHN JAE YOUNG

Self-interference cancellation method and apparatus of relay using the same frequency band in OFDM-based radio communication system

ROH YOUNGDAL

Integrated circuit packaging system with coreless substrate and method of manufacture thereof

KO YOUNG JO

Multi-cell cooperative communication system and terminal device

PARK SEONG WON

Integrated circuit packaging system with plated copper posts and method of manufacture thereof