Inventor
CHEN SHENG-CHAU
TW98 patents
Patents
50 patentsUS9437572B2Sep 6, 2016
Conductive pad structure for hybrid bonding and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD227 citations99
US9704827B2Jul 11, 2017
Hybrid bond pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD32 citations98
US10529913B1Jan 7, 2020
Techniques for MRAM MTJ top electrode connection
TAIWAN SEMICONDUCTOR MFG CO LTD15 citations94
US10163651B1Dec 25, 2018
Structure and method to expose memory cells with different sizes
TAIWAN SEMICONDUCTOR MFG CO LTD32 citations94
US10050018B2Aug 14, 2018
3DIC structure and methods of forming
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations92
US9040385B2May 26, 2015
Mechanisms for cleaning substrate surface for hybrid bonding
TAIWAN SEMICONDUCTOR MFG CO LTD24 citations92
US11152276B2Oct 19, 2021
Trim wall protection method for multi-wafer stacking
TAIWAN SEMICONDUCTOR MFG CO LTD17 citations86
US11664411B2May 30, 2023
Semiconductor structure having integrated inductor therein
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations85
US11011600B2May 18, 2021
Semiconductor structure having integrated inductor therein
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10541297B2Jan 21, 2020
Semiconductor structure having integrated inductor therein
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10164001B1Dec 25, 2018
Semiconductor structure having integrated inductor therein
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US10043705B2Aug 7, 2018
Memory device and method of forming thereof
TAIWAN SEMICONDUCTOR MFG CO LTD13 citations84
US9960200B1May 1, 2018
Selective deposition and planarization for a CMOS image sensor
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9837291B2Dec 5, 2017
Wafer processing method and apparatus
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9653507B2May 16, 2017
Deep trench isolation shrinkage method for enhanced device performance
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9281331B2Mar 8, 2016
High dielectric constant structure for the vertical transfer gates of a complementary metal-oxide semiconductor (CMOS) image sensor
TAIWAN SEMICONDUCTOR MFG CO LTD16 citations84
US11081334B2Aug 3, 2021
Particle prevention in wafer edge trimming
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83
US9666566B1May 30, 2017
3DIC structure and method for hybrid bonding semiconductor wafers
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations83
US11715674B2Aug 1, 2023
Trim wall protection method for multi-wafer stacking
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations75
US11581254B2Feb 14, 2023
Three dimensional MIM capacitor having a comb structure and methods of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations75
US12027554B2Jul 2, 2024
Composite deep trench isolation structure in an image sensor
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations74
US11901387B2Feb 13, 2024
Image sensor
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11804473B2Oct 31, 2023
Hybrid bond pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11735617B2Aug 22, 2023
Semiconductor structure, back-side illuminated image sensor and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11735624B2Aug 22, 2023
Multi-lateral recessed MIM structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11183627B2Nov 23, 2021
MRAM MTJ top electrode connection
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11183394B2Nov 23, 2021
Structure and method to expose memory cells with different sizes
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10325956B2Jun 18, 2019
Deep trench isolation shrinkage method for enhanced device performance
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10283550B2May 7, 2019
Semiconductor structure, back-side illuminated image sensor and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10269770B2Apr 23, 2019
Hybrid bond pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10096515B2Oct 9, 2018
Interconnect structure for stacked device
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9842816B2Dec 12, 2017
Conductive pad structure for hybrid bonding and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9627326B2Apr 18, 2017
Method for forming alignment marks and structure of same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11049767B2Jun 29, 2021
Semiconductor device and methods of manufacturing thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US10727097B2Jul 28, 2020
Mechanisms for cleaning substrate surface for hybrid bonding
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10522514B2Dec 31, 2019
3DIC structure and methods of forming
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US9859323B1Jan 2, 2018
Complementary metal-oxide-semiconductor (CMOS) image sensor
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US10857651B2Dec 8, 2020
Apparatus of chemical mechanical polishing and operating method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations71
US12490538B2Dec 2, 2025
Stacked structure for CMOS image sensors
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12451391B2Oct 21, 2025
Image sensor with dual trench isolation structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12266579B2Apr 1, 2025
Method and system for adjusting the gap between a wafer and a top plate in a thin-film deposition process
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12213323B2Jan 28, 2025
Embedded backside memory on a field effect transistor
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12183761B2Dec 31, 2024
Semiconductor structure, back-side illuminated image sensor and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12176370B2Dec 24, 2024
Stacked structure for CMOS image sensors including through-substrate-via contacting negative bias circuit
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12125763B2Oct 22, 2024
Trim wall protection method for multi-wafer stacking
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11925033B2Mar 5, 2024
Embedded backside memory on a field effect transistor
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US11908878B2Feb 20, 2024
Image sensor and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US11705360B2Jul 18, 2023
Image sensor with dual trench isolation structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11682652B2Jun 20, 2023
Notched wafer and bonding support structure to improve wafer stacking
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US11670539B2Jun 6, 2023
Method of making a semiconductor arrangement
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
Showing the top 50 of 98 patents by PatentIndex Score.