Inventor

CHEN XIAOMENG

TW102 patents

⚠️ This page may combine multiple inventors who share the name “CHEN XIAOMENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN XIAOMENG

TAIWAN SEMICONDUCTOR MFG CO LTD

Air trench in packages incorporating hybrid bonding

Hybrid bonding mechanisms for semiconductor wafers

Dual facing BSI image sensors with wafer level stacking

Alignment systems and wafer bonding systems and methods

3D integrated circuit and methods of forming the same

Integrate rinse module in hybrid bonding platform

Wafer processing method and apparatus

Air trench in packages incorporating hybrid bonding

Semiconductor arrangment with capacitor

Integrate rinse module in hybrid bonding platform

Semiconductor arrangement with capacitor and method of fabricating the same

Dual facing BSI image sensors with wafer level stacking

Backside illuminated photo-sensitive device with gradated buffer layer

Perpendicular magnetic random-access memory (MRAM) formation by direct self-assembly method

Dual facing BSI image sensors with wafer level stacking

Semiconductor arrangement having capacitor separated from active region

Backside illuminated photo-sensitive device with gradated buffer layer

3D integrated circuit and methods of forming the same

Alignment systems and wafer bonding systems and methods

Multiple metal layer semiconductor device and low temperature stacking method of fabricating the same

Method of manufacturing a semiconductor device including a barrier structure

Method for semiconductor wafer inspection and system thereof

Defect inspection method and defect inspection system

Integrate rinse module in hybrid bonding platform

Dual facing BSI image sensors with wafer level stacking

Integrate rinse module in hybrid bonding platform

Semiconductor arrangement with capacitor

Backside illuminated photo-sensitive device with gradated buffer layer

Integrate rinse module in hybrid bonding platform

Semiconductor arrangement having capacitor separated from active region

Semiconductor arrangement with capacitor

Perpendicular magnetic random-access memory (MRAM) formation by direct self-assembly method

TAIWAN SEMICONDUCTOR MFG

3D integrated circuit and methods of forming the same

Methods for hybrid wafer bonding

Hybrid bonding mechanisms for semiconductor wafers

Plasmonic nanostructures for organic image sensors

Semiconductor device, high electron mobility transistor (HEMT) and method of manufacturing

Transistor having an ohmic contact by screen layer and method of making the same

Transistor having doped substrate and method of making the same

Transistor having high breakdown voltage and method of making the same

Semiconductor device

Transistor having an ohmic contact by gradient layer and method of making the same

IBM

Process to increase reliability CuBEOL structures

Chip to wiring interface with single metal alloy layer applied to surface of copper interconnect

Method for reducing amine based contaminants

HUAWEI TECH CO LTD

Liquid crystal display comprising a front camera disposed inside a through hole that forms a light channel and extends through the liquid crystal display, electronic device comprising the same

Intelligent assistant control method and terminal device for recommending a photographing mode to a user

Liquid crystal display comprising an optical component having a component body that is competely or partially disposed in a pin through-hole in a backlight and electronic device having the same

KIM BYEONG Y

CMOS devices incorporating hybrid orientation technology (HOT) with embedded connectors

ZHANG ZENGBIN

Distance measurements between computing devices