Inventor

HUANG CHIH-MING

TW81 patents

⚠️ This page may combine multiple inventors who share the name “HUANG CHIH-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG CHIH-MING

SILICONWARE PRECISION INDUSTRIES CO LTD

Module device of stacked semiconductor packages and method for fabricating the same

Ball grid array semiconductor package and substrate without power ring or ground ring

Wafer level semiconductor package with build-up layer and method for fabricating the same

Ground pad structure for preventing solder extrusion and semiconductor package having the ground pad structure

Stacked semiconductor structure and fabrication method thereof

Semiconductor package with a heat sink

Semiconductor package with photosensitive chip and fabrication method thereof

Semiconductor package with enhanced electrical and thermal performance and method for fabricating the same

Method for fabricating semiconductor package free of substrate

Semiconductor package free of substrate and fabrication method thereof

IC card type circuit module

Semiconductor package free of substrate and fabrication method thereof

Window-type ball grid array semiconductor package with lead frame as chip carrier and method for fabricating the same

IC card type circuit module

Digital memory card

Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof

Heat dissipating semiconductor package and fabrication method thereof

Sensor semiconductor device and fabrication method of the sensor semiconductor device

Method for fabricating wafer level semiconductor package with build-up layer

Semiconductor package free of substrate and fabrication method thereof

Method for fabricating sensor semiconductor device

Fabrication method of semiconductor package with photosensitive chip

Method of fabricating BGA packages

Electronic carrier board applicable to surface mounted technology (SMT)

Semiconductor package with lead frame as chip carrier and method for fabricating the same

Method for fabricating semiconductor package free of substrate

Semiconductor package with enhanced electrical and thermal performance and method for fabricating the same

Digital memory card

Semiconductor package for memory chips

Sensor semiconductor device with sensor chip

Method for fabricating semiconductor package free of substrate

Printed circuit board and method for fabricating the same

Electronic package and manufacturing method thereof

Electronic package and manufacturing method thereof

TONGFANG GLOBAL LTD

Display connector

Computer monitor

Rotary lighting fixture having speaker with playback function

HEWLETT PACKARD DEVELOPMENT CO

Dual-transceiver based input devices

Wireless peripheral docks and sensors

HUANG CHIEN-PING

Method for fabricating heat dissipating semiconductor package

Method of fabricating stacked semiconductor structure

UNITED MICROELECTRONICS CORP

Method of fabricating Cu interconnects with reduced Cu contamination

Semiconductor read-only memory device and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG

Integrated defect yield management and query system

SILICONWARE PRECISION IND CO L

Encapsulating method of substrate based electronic device

CHIU CHI-HSIN

Fabrication method of package structure having MEMS element

HUANG CHIH-MING

Back sliding massager

HON HAI PREC IND CO LTD

Electronic apparatus and cover mechanism

CHAN CHANG-YUEH

Leadframe-based semiconductor package

LITE ON ELECTRONICS GUANGZHOU

Repetitive data processing method for solid state drive