Inventor · disambiguated record

Wei-Wen Lan

Also filed as: LAN WEI-WEN

2 granted patents·0 citations·filing 2008–2008

23Inventor score

Technology areasH05K

Files withLEE MENG-HAN1 NAN YA PRINTED CIRCUIT BOARD1

Top patents by PatentIndex Score

2 records

0135US7877873B2Method for forming a wire bonding substrateNAN YA PRINTED CIRCUIT BOARD·Filed 2008·Granted Feb 1, 2011·0 cites·10 claims
0234US8058567B2High density package substrate and method for fabricating the sameLEE MENG-HAN·Filed 2008·Granted Nov 15, 2011·0 cites·11 claims

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