Inventor · disambiguated record
Kimihiro Yamanaka
Also filed as: YAMANAKA KIMIHIRO
11 granted patents·2 pending applications·219 citations·filing 1992–2011
91Inventor score
Top patents by PatentIndex Score
13 records- 0193US6985362B2Printed circuit board and electronic package using sameIBM·Filed 2001·Granted Jan 10, 2006·70 cites·5 claims
- 0286US6486414B2Through-hole structure and printed circuit board including the through-hole structureIBM·Filed 2001·Granted Nov 26, 2002·38 cites·30 claims
- 0375US9110234B2Optical module and optical wiring boardTERADA KENJI·Filed 2011·Granted Aug 18, 2015·5 cites·10 claims
- 0470US8446734B2Circuit board and mounting structureHAYASHI KATSURA·Filed 2007·Granted May 21, 2013·6 cites·4 claims
- 0570US5517756AMethod of making substrate member having electrical lines and apertured insulating filmIBM·Filed 1994·Granted May 21, 1996·39 cites·3 claims
- 0667US8350161B2Circuit board and structure using the sameKYCERA CORP·Filed 2010·Granted Jan 8, 2013·3 cites·14 claims
- 0767US7084355B2Multilayer printed circuit boardIBM·Filed 2003·Granted Aug 1, 2006·17 cites·6 claims
- 0867US5252781ASubstrate member having electric lines and apertured insulating filmIBM·Filed 1992·Granted Oct 12, 1993·34 cites·6 claims
- 0957US8253027B2Circuit board and structure using the sameYAMANAKA KIMIHIRO·Filed 2010·Granted Aug 28, 2012·1 cites·9 claims
- 1056US6667559B2Ball grid array module and method of manufacturing sameIBM·Filed 2002·Granted Dec 23, 2003·6 cites·19 claims
- 1146US8284557B2Circuit board, mounting structure, and method for manufacturing circuit boardTSUKADA YUTAKA·Filed 2008·Granted Oct 9, 2012·0 cites·9 claims
- 1239US2008164057A1Printed Wiring Board And Method Of Manufacturing SameMORI HIROYUKI·Filed 2004·Application pending·0 cites
- 1338US2004164060A1Hole drilling method and apparatusIBM·Filed 2004·Application pending·0 cites
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