Inventor
LONG JON M
US26 patents
⚠️ This page may combine multiple inventors who share the name “LONG JON M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
VLSI TECHNOLOGY INC
12 patentsUS5260234ANov 9, 1993
Method for bonding a lead to a die pad using an electroless plating solution
VLSI TECHNOLOGY INC122 citations98
US5349495ASep 20, 1994
System for securing and electrically connecting a semiconductor chip to a substrate
VLSI TECHNOLOGY INC67 citations96
US5233131AAug 3, 1993
Integrated circuit die-to-leadframe interconnect assembly system
VLSI TECHNOLOGY INC35 citations92
US5210440AMay 11, 1993
Semiconductor chip cooling apparatus
VLSI TECHNOLOGY INC50 citations92
US5206794AApr 27, 1993
Integrated circuit package with device and wire coat assembly
VLSI TECHNOLOGY INC44 citations92
US5166607ANov 24, 1992
Method and apparatus to heat the surface of a semiconductor die in a device during burn-in while withdrawing heat from device leads
VLSI TECHNOLOGY INC19 citations82
US5407275AApr 18, 1995
Non-destructive test for inner lead bond of a tab device
VLSI TECHNOLOGY INC8 citations74
US5304738AApr 19, 1994
System for protecting leads of a semiconductor chip package during testing, burn-in and handling
VLSI TECHNOLOGY INC8 citations74
US5221812AJun 22, 1993
System for protecting leads to a semiconductor chip package during testing, burn-in and handling
VLSI TECHNOLOGY INC6 citations74
US5210375AMay 11, 1993
Electronic device package--carrier assembly ready to be mounted onto a substrate
VLSI TECHNOLOGY INC6 citations74
US5218215AJun 8, 1993
Semiconductor device package having a thermal dissipation means that allows for lateral movement of the lead frame with respect to the housing without breakage of the thermal dissipation path
VLSI TECHNOLOGY INC19 citations72
US5408741AApr 25, 1995
Method for forming electronic device
VLSI TECHNOLOGY INC0 citations52
ALTERA CORP
3 patentsUS7405477B1Jul 29, 2008
Ball grid array package-to-board interconnect co-design apparatus
ALTERA CORP100 citations95
US7514789B1Apr 7, 2009
Ball grid array package-to-board interconnect co-design apparatus
ALTERA CORP30 citations90
US7091613B1Aug 15, 2006
Elongated bonding pad for wire bonding and sort probing
ALTERA CORP11 citations83
MICRON TECHNOLOGY INC
3 patentsUS6303469B1Oct 16, 2001
Thin microelectronic substrates and methods of manufacture
MICRON TECHNOLOGY INC63 citations92
US6693342B2Feb 17, 2004
Thin microelectronic substrates and methods of manufacture
MICRON TECHNOLOGY INC8 citations70
US6914317B2Jul 5, 2005
Thin microelectronic substrates and methods of manufacture
MICRON TECHNOLOGY INC0 citations48