Inventor
LU TUNG BAO
TW6 patents
Patents
6 patentsUS8779604B1Jul 15, 2014
Semiconductor structure and manufacturing method thereof
CHIPMOS TECHNOLOGIES INC9 citations81
US8877630B1Nov 4, 2014
Semiconductor structure having a silver alloy bump body and manufacturing method thereof
CHIPMOS TECHNOLOGIES INC5 citations70
US9780056B1Oct 3, 2017
Solder ball, manufacturing method thereof, and semiconductor device
CHIPMOS TECHNOLOGIES INC3 citations69
US9721913B2Aug 1, 2017
Semiconductor package and method of manufacturing thereof
CHIPMOS TECHNOLOGIES INC3 citations65
US9865777B2Jan 9, 2018
Semicondcutor light-emitting device and fabricating method thereof
CHIPMOS TECHNOLOGIES INC0 citations48
US9620445B1Apr 11, 2017
Chip package structure and method of manufacturing the same
CHIPMOS TECHNOLOGIES INC0 citations48