Inventor
SONG HOGEON
KR6 patents
⚠️ This page may combine multiple inventors who share the name “SONG HOGEON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
3 patentsUS9202716B2Dec 1, 2015
Methods of fabricating fan-out wafer level packages and packages formed by the methods
SAMSUNG ELECTRONICS CO LTD18 citations83
US10008488B2Jun 26, 2018
Semiconductor module adapted to be inserted into connector of external device
SAMSUNG ELECTRONICS CO LTD3 citations69
US11257723B2Feb 22, 2022
Inspection system and method for inspecting semiconductor package, and method of fabricating semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations61
JEONG SEYOUNG
3 patentsUS9793165B2Oct 17, 2017
Methods of fabricating semiconductor devices
JEONG SEYOUNG3 citations69
US8766455B2Jul 1, 2014
Stacked semiconductor devices and fabrication methods thereof
JEONG SEYOUNG3 citations57
US8933561B2Jan 13, 2015
Semiconductor device for semiconductor package having through silicon vias of different heights
JEONG SEYOUNG0 citations38