Methods of fabricating fan-out wafer level packages and packages formed by the methods

Abstract

A fan-out wafer level package may include at least two semiconductor chips; an insulating layer covering portions of a first semiconductor chip; a mold layer covering portions of a second semiconductor chip; a redistribution line pattern in the insulating layer; and/or an external terminal on the insulating layer. The first semiconductor chip may be stacked relative to the second semiconductor chip. The redistribution line pattern may be electrically connected to the at least two semiconductor chips. The external terminal may be electrically connected to the redistribution line pattern. A fan-out wafer level package may include at least three semiconductor chips; an insulating layer covering portions of first semiconductor chips; a mold layer covering portions of a second semiconductor chip; a redistribution line pattern in the insulating layer; and/or an external terminal on the insulating layer. The first semiconductor chips may be stacked relative to the second semiconductor chip.

What is claimed is: 
     
       1. A fan-out wafer level package, comprising:
 at least two semiconductor chips sequentially stacked; 
 an insulating layer covering a bottom surface and one sidewall of a lowermost semiconductor chip of the at least two semiconductor chips; 
 a mold layer covering a top surface of an uppermost semiconductor chip of the at least two semiconductor chips, the mold layer having a width greater than widths of the at least two semiconductor chips; 
 a redistribution line pattern in the insulating layer, the redistribution line pattern electrically connected to the at least two semiconductor chips; and 
 an external terminal on an opposite side of the insulating layer from the at least two semiconductor chips, the external terminal in contact with the redistribution line pattern. 
 
     
     
       2. The fan-out wafer level package of  claim 1 , wherein end portions of the at least two semiconductor chips are formed in a stepped-shape,
 wherein the mold layer extends to cover both sidewalls of the uppermost semiconductor chip, and 
 wherein the insulating layer extends to cover both sidewalls of the lowermost semiconductor chip. 
 
     
     
       3. The fan-out wafer level package of  claim 2 , wherein the mold layer comprises a protrusion extending to be in contact with one end portion of a semiconductor chip under the uppermost semiconductor chip, and
 wherein the insulating layer extends to be in contact with another end portion of the semiconductor chip under the uppermost semiconductor chip. 
 
     
     
       4. The fan-out wafer level package of  claim 3 , wherein the insulating layer extends to cover a sidewall of the protrusion. 
     
     
       5. The fan-out wafer level package of  claim 1 , wherein the uppermost semiconductor chip has a width greater than a width of the lowermost semiconductor chip, so that the uppermost semiconductor chip covers an entire top surface of the lowermost semiconductor chip,
 wherein the insulating layer extends to cover both sidewalls of the lowermost semiconductor chip, and 
 wherein the mold layer extends to cover a sidewall of the insulating layer. 
 
     
     
       6. The fan-out wafer level package of  claim 1 , wherein the uppermost semiconductor chip covers at least two lowermost semiconductor chips of the at least two semiconductor chips adjacent to each other simultaneously, and
 wherein the insulating layer fills a space between the at least two lowermost semiconductor chips adjacent to each other. 
 
     
     
       7. The fan-out wafer level package of  claim 6 , wherein the mold layer extends to covers sidewalls of the at least two lowermost semiconductor chips adjacent to each other simultaneously. 
     
     
       8. The fan-out wafer level package of  claim 1 , wherein the insulating layer extends to cover both sidewalls of the uppermost semiconductor chip. 
     
     
       9. A fan-out wafer level package, comprising:
 at least two semiconductor chips; 
 an insulating layer covering portions of a first semiconductor chip of the at least two semiconductor chips; 
 a mold layer covering portions of a second semiconductor chip of the at least two semiconductor chips; 
 a redistribution line pattern in the insulating layer; and 
 an external terminal on an opposite side of the insulating layer from the at least two semiconductor chips; 
 wherein the first semiconductor chip is stacked relative to the second semiconductor chip, 
 wherein the redistribution line pattern is electrically connected to the at least two semiconductor chips, and 
 wherein the external terminal is electrically connected to the redistribution line pattern. 
 
     
     
       10. The fan-out wafer level package of  claim 9 , wherein the insulating layer covers portions of the second semiconductor chip. 
     
     
       11. The fan-out wafer level package of  claim 9 , wherein the insulating layer covers portions of the at least two semiconductor chips. 
     
     
       12. The fan-out wafer level package of  claim 9 , wherein the mold layer covers portions of the first semiconductor chip. 
     
     
       13. The fan-out wafer level package of  claim 9 , wherein the mold layer covers portions of the at least two semiconductor chips. 
     
     
       14. The fan-out wafer level package of  claim 9 , wherein the insulating layer covers sidewall portions of the at least two semiconductor chips. 
     
     
       15. The fan-out wafer level package of  claim 9 , wherein the mold layer covers sidewall portions of the at least two semiconductor chips. 
     
     
       16. A fan-out wafer level package, comprising:
 at least three semiconductor chips; 
 an insulating layer covering portions of first semiconductor chips of the at least three semiconductor chips; 
 a mold layer covering portions of a second semiconductor chip of the at least three semiconductor chips; 
 a redistribution line pattern in the insulating layer; and 
 an external terminal on an opposite side of the insulating layer from the at least three semiconductor chips; 
 wherein the first semiconductor chips are stacked relative to the second semiconductor chip, 
 wherein the redistribution line pattern is electrically connected to the at least three semiconductor chips, and 
 wherein the external terminal is electrically connected to the redistribution line pattern. 
 
     
     
       17. The fan-out wafer level package of  claim 16 , wherein the insulating layer covers portions of the second semiconductor chip. 
     
     
       18. The fan-out wafer level package of  claim 16 , wherein the insulating layer covers portions of the at least three semiconductor chips. 
     
     
       19. The fan-out wafer level package of  claim 16 , wherein the mold layer covers portions of the first semiconductor chips. 
     
     
       20. The fan-out wafer level package of  claim 16 , wherein the mold layer covers portions of the at least three semiconductor chips.