Inventor · disambiguated record
Seokhyun Lee
Also filed as: LEE SEOKHYUN
70 granted patents·33 pending applications·125 citations·filing 2010–2025
98Inventor score
Files withSAMSUNG ELECTRONICS CO LTD97JANG AE-NEE1JANG JAEGWON1KOREA ADVANCED INST SCI & TECH1LEE SEOKHYUN1
Top patents by PatentIndex Score
103 records- 0197US11626393B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 11, 2023·4 cites·19 claims
- 0296US11616051B2Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 28, 2023·4 cites·20 claims
- 0396US11610785B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 21, 2023·4 cites·20 claims
- 0495US9640513B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 2, 2017·15 cites·14 claims
- 0594US12205939B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 21, 2025·2 cites·18 claims
- 0694US11869775B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 9, 2024·2 cites·20 claims
- 0794US10541201B2Semiconductor package, package-on-package device, and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 21, 2020·9 cites·20 claims
- 0893US12057435B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 6, 2024·2 cites·20 claims
- 0993US11145611B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 12, 2021·3 cites·19 claims
- 1092US12327824B2Semiconductor package including redistribution substrateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 10, 2025·2 cites·20 claims
- 1192US12170251B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 17, 2024·2 cites·20 claims
- 1292US11810915B2Semiconductor package with redistribution substrate having embedded passive deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 7, 2023·2 cites·20 claims
- 1392US9202716B2Methods of fabricating fan-out wafer level packages and packages formed by the methodsSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Dec 1, 2015·18 cites·20 claims
- 1491US10930625B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 23, 2021·5 cites·19 claims
- 1591US10522471B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 31, 2019·7 cites·23 claims
- 1689US12293989B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 6, 2025·1 cites·20 claims
- 1789US11348876B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 31, 2022·2 cites·20 claims
- 1889US10950539B2Redistribution substrate, method of fabricating the same, and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 16, 2021·5 cites·21 claims
- 1988US11705341B2Method of fabricating a semiconductor package having redistribution patterns including seed patterns and seed layersSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 18, 2023·1 cites·20 claims
- 2088US11456241B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 27, 2022·2 cites·18 claims
- 2188US11282995B2Display module packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 22, 2022·2 cites·20 claims
- 2288US10756015B2Semiconductor package, package-on-package device, and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 25, 2020·4 cites·20 claims
- 2387US11348864B2Redistribution substrate having redistribution pattern including via seed patterns covering bottom surface and sidewall surface of wiring conductive patterns and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 31, 2022·2 cites·19 claims
- 2485US11605584B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 14, 2023·1 cites·20 claims
- 2585US2025364489A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2682US12394753B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Aug 19, 2025·0 cites·20 claims
- 2782US10319650B2Semiconductor package having redistribution pattern and passivation patterns and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 11, 2019·3 cites·17 claims
- 2882US2024332268A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2981US11858772B2Strip cutting apparatus for diagnostic reagent kitLEE SEOKHYUN·Filed 2021·Granted Jan 2, 2024·1 cites·6 claims
- 3081US10879292B2Semiconductor package and method of manufacturing the sameJANG JAEGWON·Filed 2019·Granted Dec 29, 2020·4 cites·20 claims
- 3180US12009350B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 11, 2024·0 cites·19 claims
- 3280US11075149B2Redistribution substrate, method of manufacturing the same, and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 27, 2021·2 cites·20 claims
- 3380US10741518B2Method of fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 11, 2020·2 cites·20 claims
- 3479US11056461B2Method of manufacturing fan-out wafer level packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 6, 2021·1 cites·19 claims
- 3579US10861927B2Electro-luminescent display device with improved contact structureLG DISPLAY CO LTD·Filed 2019·Granted Dec 8, 2020·2 cites·23 claims
- 3677US12237256B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 3777US2025192131A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3876US11973028B2Redistribution substrate, method of fabricating the same, and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 30, 2024·0 cites·20 claims
- 3976US9716048B2Semiconductor device having a peripheral-region defect detection structureSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jul 25, 2017·2 cites·15 claims
- 4076US2025070038A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4175US10879187B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 29, 2020·2 cites·18 claims
- 4275US2025343196A1Semiconductor package including redistribution substrate and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 4374US12394700B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 4473US2025112193A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4573US2025167098A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 4672US10964643B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 30, 2021·1 cites·20 claims
- 4771US12087744B2Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 10, 2024·0 cites·19 claims
- 4871US11869835B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 9, 2024·0 cites·20 claims
- 4971US2025239572A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 5071US2024021608A1Semiconductor package with redistribution substrate having embedded passive deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
Showing the top 50 of 103 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →