Inventor

SUN LIZHONG

US62 patents

⚠️ This page may combine multiple inventors who share the name “SUN LIZHONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SUN LIZHONG

APPLIED MATERIALS INC

Method and apparatus for electrochemical-mechanical planarization

Electrolyte composition and treatment for electrolytic chemical mechanical polishing

Method and apparatus for face-up substrate polishing

Method and apparatus for electrochemical-mechanical planarization

Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus

Conductive polishing article for electrochemical mechanical polishing

Conductive polishing article for electrochemical mechanical polishing

Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP

Method and apparatus for two-step barrier layer polishing

Method of initiating cooper CMP process

Method and composition for the selective removal of residual materials and barrier materials during substrate planarization

Cu CMP polishing pad cleaning

Barrier removal at low polish pressure

Selective removal of tantalum-containing barrier layer during metal CMP

Method for chemical mechanical polishing of semiconductor substrates

Solution to metal re-deposition during substrate planarization

Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform

Electrochemically assisted chemical polish

Method for abrasive-free metal CMP in passivation domain

Conductive polishing article for electrochemical mechanical polishing

Pad cleaning for a CMP system

Electrochromic devices with Si, Sn, SiO2 and SnO2 doped anodes

Pinhole-free solid state electrolytes with high ionic conductivity

Control of removal profile in electrochemically assisted CMP

Methods and compositions for chemical mechanical polishing

Elimination of pad glazing for Al CMP

Methods for reducing delamination during chemical mechanical polishing

Method and composition for the removal of residual materials during substrate planarization

Tantalum removal during chemical mechanical polishing

Method and apparatus for tuning film properties during thin film deposition

Polishing pad conditioning system including suction

Energy storage device having an interlayer between electrode and electrolyte layer

Methods for reducing surface defects in active film layers

Green printing ink for color filter applications

Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP

Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus

Dual reduced agents for barrier removal in chemical mechanical polishing

Tilted magnetron in a PVD sputtering deposition chamber

AGERE SYSTEMS INC

VCO gain self-calibration for low voltage phase lock-loop applications

Low-noise, fast-lock phase-lock loop with “gearshifting” control

Fractional-N baseband frequency synthesizer in bluetooth applications

Fractional-N baseband frequency synthesizer in bluetooth applications

SILICON LAB INC

Programmable frequency divider

High-speed divider with reduced power consumption

Phase selectable divider circuit

AGERE SYST GUARDIAN CORP

Charge pump for low-voltage, low-jitter phase locked loops

Low voltage differential voltage-controlled ring oscillator

RODEL INC

Method for photoelectrochemical polishing of silicon wafers

Apparatus for photoelectrochemical polishing of silicon wafers

PMC SIERRA LTD

High speed wide tuning range multi-phase output ring oscillator