Inventor

SUGO MICHIHIRO

JP78 patents

⚠️ This page may combine multiple inventors who share the name “SUGO MICHIHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SUGO MICHIHIRO

SHINETSU CHEMICAL CO

Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting film

Polymer containing silphenylene and polyether structures

Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer

Wafer temporary bonding method and thin wafer manufacturing method

Wafer process body, wafer processing member, wafer processing temporary adhesive material, and method for manufacturing thin wafer

Polyimide resin soluble in aqueous alkaline solution, composition comprising the resin and cured coating prepared from the composition

Polyimide silicone resin, process for its production, and polyimide silicone resin composition

Radiation-curable resin compositions

Colorless and transparent polyimidesilicone resin having thermosetting functional groups

Imide silicone resin and production process therefor

Trimethylsiloxy group-containing polysiloxane and a process for producing the same

Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the same

Semiconductor device, making method, and laminate

Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer

Wafer processing laminate and method for processing wafer

Wafer processing temporary bonding arrangement, wafer processing laminate, and thin wafer manufacturing method

Wafer processing bonding arrangement, wafer laminate, and thin wafer manufacturing method

Temporary adhesion method and method for producing thin wafer

Temporary adhesive material for wafer, film for temporary adhesion using same, wafer processing laminate, and method for producing thin wafer using same

Temporary adhesive material for wafer processing, wafer processing laminate, and method for manufacturing thin wafer using same

Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer

Solvent-free polymide silicone resin composition and a cured resin film thereof

Resin composition, resin film, method for producing resin film, method for producing semiconductor device, and semiconductor device

Method for producing thin wafer

Wafer laminate, method for production thereof, and adhesive composition for wafer laminate

Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method

Temporary adhesive composition and method for manufacturing thin wafer using the same

Polyimide silicone resin and thermosetting composition comprising the same

Polyimide having an alcoholic hydroxyl group and a process for the preparation thereof

Siloxane copolymer, making method, and thermosetting resin composition

Method of dry cleaning and dry cleaning solvent therefor

Electrode-forming compositions and electrode members

Solventless polyimide silicone resin compositions

Polyimide silicone resin, its solution composition, and polyimide silicone resin film

Trimethylsiloxy group-containing polysiloxane and a process for producing the same

Cleaning solution for temporary adhesive for substrates, substrate cleaning method, and cleaning method for support or substrate

Detergent composition, substrate cleaning method, and cleaning method for support or substrate

Method for manufacturing laminate and method for manufacturing substrate

Wafer processing laminate and method for processing wafer

Alcoholic hydroxyl-containing compounds and making method

Phenolic OH-containing polyimide silicone, epoxy resin and curing agent

Heat-curable polyimide silicone resin composition

Temporary adhesive for wafer processing, wafer laminate and method for producing thin wafer

Photosensitive resin composition, photosensitive dry film, and pattern forming process

Method for manufacturing thin substrate

SUGO MICHIHIRO

Polymer having silphenylene and siloxane structures, a method of preparing the same, an adhesive composition, an adhesive sheet, a protective material for a semiconductor device, and a semiconductor device

KATO HIDETO

Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method

FURUYA MASAHIRO

Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said composition

KONDO KAZUNORI

Adhesive composition, adhesive sheet, semiconductor apparatus protection material, and semiconductor apparatus

TAGAMI SHOHEI

Polyimide silicone, photosensitive resin composition containing the novel polyimide silicone, and method for pattern formation