Inventor
HSU TING-CHEN
US15 patents
⚠️ This page may combine multiple inventors who share the name “HSU TING-CHEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
5 patentsUS11063157B1Jul 13, 2021
Trench capacitor profile to decrease substrate warpage
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83
US11769792B2Sep 26, 2023
Trench capacitor profile to decrease substrate warpage
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US12176387B2Dec 24, 2024
Trench capacitor profile to decrease substrate warpage
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10693019B2Jun 23, 2020
Film scheme for a high density trench capacitor
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12199139B2Jan 14, 2025
Trench capacitor film scheme to reduce substrate warpage
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
MOTOROLA INC
4 patentsUS5589423ADec 31, 1996
Process for fabricating a non-silicided region in an integrated circuit
MOTOROLA INC55 citations92
US5707889AJan 13, 1998
Process for forming field isolation
MOTOROLA INC21 citations91
US5661082AAug 26, 1997
Process for forming a semiconductor device having a bond pad
MOTOROLA INC30 citations90
US5814893ASep 29, 1998
Semiconductor device having a bond pad
MOTOROLA INC16 citations80
TAIWAN SEMICONDUCTOR MFG
4 patentsUS9373627B2Jun 21, 2016
Multiple-time programming memory cells and methods for forming the same
TAIWAN SEMICONDUCTOR MFG2 citations61
US8853079B2Oct 7, 2014
Fuse device
TAIWAN SEMICONDUCTOR MFG0 citations51
US8952442B2Feb 10, 2015
Multiple-time programming memory cells and methods for forming the same
TAIWAN SEMICONDUCTOR MFG0 citations50
US8962439B2Feb 24, 2015
Memory cell
TAIWAN SEMICONDUCTOR MFG0 citations41