P

Inventor

WANG JOHN JIANSHI

US33 patents
⚠️ This page may combine multiple inventors who share the name “WANG JOHN JIANSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANCED MICRO DEVICES INC

32 patents
US6180454B1Jan 30, 2001

Method for forming flash memory devices

ADVANCED MICRO DEVICES INC62 citations94
US6057193AMay 2, 2000

Elimination of poly cap for easy poly1 contact for NAND product

ADVANCED MICRO DEVICES INC36 citations93
US6380029B1Apr 30, 2002

Method of forming ono stacked films and DCS tungsten silicide gate to improve polycide gate performance for flash memory devices

ADVANCED MICRO DEVICES INC23 citations92
US6355522B1Mar 12, 2002

Effect of doped amorphous Si thickness on better poly 1 contact resistance performance for nand type flash memory devices

ADVANCED MICRO DEVICES INC21 citations92
US6362049B1Mar 26, 2002

High yield performance semiconductor process flow for NAND flash memory products

ADVANCED MICRO DEVICES INC27 citations89
US6924220B1Aug 2, 2005

Self-aligned gate formation using polysilicon polish with peripheral protective layer

ADVANCED MICRO DEVICES INC12 citations84
US6797650B1Sep 28, 2004

Flash memory devices with oxynitride dielectric as the charge storage media

ADVANCED MICRO DEVICES INC14 citations84
US6784061B1Aug 31, 2004

Process to improve the Vss line formation for high density flash memory and related structure associated therewith

ADVANCED MICRO DEVICES INC14 citations84
US6717850B1Apr 6, 2004

Efficient method to detect process induced defects in the gate stack of flash memory devices

ADVANCED MICRO DEVICES INC14 citations84
US6072191AJun 6, 2000

Interlevel dielectric thickness monitor for complex semiconductor chips

ADVANCED MICRO DEVICES INC15 citations81
US6777957B1Aug 17, 2004

Test structure to measure interlayer dielectric effects and breakdown and detect metal defects in flash memories

ADVANCED MICRO DEVICES INC8 citations74
US6764920B1Jul 20, 2004

Method for reducing shallow trench isolation edge thinning on tunnel oxides using partial nitride strip and small bird's beak formation for high performance flash memory devices

ADVANCED MICRO DEVICES INC10 citations74
US6734080B1May 11, 2004

Semiconductor isolation material deposition system and method

ADVANCED MICRO DEVICES INC8 citations74
US6590260B1Jul 8, 2003

Memory device having improved programmability

ADVANCED MICRO DEVICES INC9 citations74
US6410458B1Jun 25, 2002

Method and system for eliminating voids in a semiconductor device

ADVANCED MICRO DEVICES INC9 citations74
US6376309B2Apr 23, 2002

Method for reduced gate aspect ratio to improve gap-fill after spacer etch

ADVANCED MICRO DEVICES INC6 citations74
US6211058B1Apr 3, 2001

Semiconductor device with multiple contact sizes

ADVANCED MICRO DEVICES INC10 citations74
US5994780ANov 30, 1999

Semiconductor device with multiple contact sizes

ADVANCED MICRO DEVICES INC6 citations74
US6063668AMay 16, 2000

Poly I spacer manufacturing process to eliminate polystringers in high density nand-type flash memory devices

ADVANCED MICRO DEVICES INC12 citations73
US6140246AOct 31, 2000

In-situ P doped amorphous silicon by NH3 to form oxidation resistant and finer grain floating gates

ADVANCED MICRO DEVICES INC7 citations72
US6825083B1Nov 30, 2004

Method for reducing shallow trench isolation edge thinning on thin gate oxides to improve peripheral transistor reliability and performance for high performance flash memory devices

ADVANCED MICRO DEVICES INC5 citations63
US6445051B1Sep 3, 2002

Method and system for providing contacts with greater tolerance for misalignment in a flash memory

ADVANCED MICRO DEVICES INC3 citations63
US6423612B1Jul 23, 2002

Method of fabricating a shallow trench isolation structure with reduced topography

ADVANCED MICRO DEVICES INC2 citations63
US6410949B2Jun 25, 2002

Flash memory device with monitor structure for monitoring second gate over-etch

ADVANCED MICRO DEVICES INC2 citations63
US6323047B1Nov 27, 2001

Method for monitoring second gate over-etch in a semiconductor device

ADVANCED MICRO DEVICES INC3 citations63
US6312991B1Nov 6, 2001

Elimination of poly cap easy poly 1 contact for NAND product

ADVANCED MICRO DEVICES INC4 citations63
US6300658B1Oct 9, 2001

Method for reduced gate aspect ration to improve gap-fill after spacer etch

ADVANCED MICRO DEVICES INC2 citations63
US6350627B1Feb 26, 2002

Interlevel dielectric thickness monitor for complex semiconductor chips

ADVANCED MICRO DEVICES INC2 citations62
US6177312B1Jan 23, 2001

Method for removing contaminate nitrogen from the peripheral gate region of a non-volatile memory device during production of such device

ADVANCED MICRO DEVICES INC5 citations62
US6281078B1Aug 28, 2001

Manufacturing process to eliminate ONO fence material in high density NAND-type flash memory devices

ADVANCED MICRO DEVICES INC6 citations61
US6420240B1Jul 16, 2002

Method for reducing the step height of shallow trench isolation structures

ADVANCED MICRO DEVICES INC1 citations52
US6017786AJan 25, 2000

Method for forming a low barrier height oxide layer on a silicon substrate

ADVANCED MICRO DEVICES INC1 citations45

ADVANCE MICRO DEVICES INC

1 patent