Inventor
IWAYA AKIHIKO
JP18 patents
⚠️ This page may combine multiple inventors who share the name “IWAYA AKIHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
15 patentsUS5571428ANov 5, 1996
Semiconductor leadframe and its production method and plastic encapsulated semiconductor device
HITACHI LTD113 citations98
US5714405AFeb 3, 1998
Semiconductor device
HITACHI LTD98 citations97
US6452266B1Sep 17, 2002
Semiconductor device
HITACHI LTD61 citations96
US5583375ADec 10, 1996
Semiconductor device with lead structure within the planar area of the device
HITACHI LTD73 citations96
US5437915AAug 1, 1995
Semiconductor leadframe and its production method and plastic encapsulated semiconductor device
HITACHI LTD47 citations96
US6064112AMay 16, 2000
Resin-molded semiconductor device having a lead on chip structure
HITACHI LTD21 citations93
US6392295B1May 21, 2002
Semiconductor device
HITACHI LTD18 citations92
US6137159AOct 24, 2000
Lead on chip semiconductor device and method of fabricating the same
HITACHI LTD18 citations92
US5252854AOct 12, 1993
Semiconductor device having stacked lead structure
HITACHI LTD51 citations92
US6617196B2Sep 9, 2003
Semiconductor device
HITACHI LTD11 citations74
US6576994B2Jun 10, 2003
Semiconductor device
HITACHI LTD5 citations74
US6388318B1May 14, 2002
Surface mount-type package of ball grid array with multi-chip mounting
HITACHI LTD11 citations74
US5869888AFeb 9, 1999
Semiconductor device with lead structure on principal surface of chip
HITACHI LTD12 citations73
US6545349B2Apr 8, 2003
Semiconductor device
HITACHI LTD4 citations63
US6610561B2Aug 26, 2003
Method of fabricating a semiconductor device
HITACHI LTD2 citations62