Inventor
KUMAR MAHENDER
US24 patents
⚠️ This page may combine multiple inventors who share the name “KUMAR MAHENDER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
18 patentsUS7118986B2Oct 10, 2006
STI formation in semiconductor device including SOI and bulk silicon regions
IBM258 citations98
US7151023B1Dec 19, 2006
Metal gate MOSFET by full semiconductor metal alloy conversion
IBM80 citations97
US7659157B2Feb 9, 2010
Dual metal gate finFETs with single or dual high-K gate dielectric
IBM29 citations92
US7375410B2May 20, 2008
Ultra-thin SOI vertical bipolar transistors with an inversion collector on thin-buried oxide (BOX) for low substrate-bias operation and methods thereof
IBM17 citations92
US7115965B2Oct 3, 2006
Vertical bipolar transistor with a majority carrier accumulation layer as a subcollector for SOI BiCMOS with reduced buried oxide thickness for low-substrate bias operation
IBM16 citations92
US10770388B2Sep 8, 2020
Transistor with recessed cross couple for gate contact over active region integration
IBM8 citations84
US7528027B1May 5, 2009
Structure and method for manufacturing device with ultra thin SOI at the tip of a V-shape channel
IBM12 citations84
US7485537B2Feb 3, 2009
Method of fabricating a vertical bipolar transistor with a majority carrier accumulation layer as a subcollector for SOI BiCMOS with reduced buried oxide thickness
IBM12 citations83
US7691716B2Apr 6, 2010
Vertical bipolar transistor with a majority carrier accumulation layer as a subcollector for SOI BiCMOS with reduced buried oxide thickness for low-substrate bias operation
IBM10 citations82
US7485510B2Feb 3, 2009
Field effect device including inverted V shaped channel region and method for fabrication thereof
IBM15 citations82
US7911024B2Mar 22, 2011
Ultra-thin SOI vertical bipolar transistors with an inversion collector on thin-buried oxide (BOX) for low substrate-bias operation and methods thereof
IBM6 citations73
US8053838B2Nov 8, 2011
Structures, fabrication methods, design structures for strained fin field effect transistors (FinFets)
IBM3 citations63
US7790553B2Sep 7, 2010
Methods for forming high performance gates and structures thereof
IBM5 citations62
US7763518B2Jul 27, 2010
Ultra-thin SOI vertical bipolar transistors with an inversion collector on thin-buried oxide (BOX) for low substrate-bias operation and methods thereof
IBM4 citations62
US7394131B2Jul 1, 2008
STI formation in semiconductor device including SOI and bulk silicon regions
IBM4 citations62
US7790541B2Sep 7, 2010
Method and structure for forming multiple self-aligned gate stacks for logic devices
IBM3 citations60
US7943474B2May 17, 2011
EDRAM including metal plates
IBM0 citations52
US6995094B2Feb 7, 2006
Method for deep trench etching through a buried insulator layer
IBM0 citations51
GLOBALFOUNDRIES INC
4 patentsUS10461186B1Oct 29, 2019
Methods of forming vertical field effect transistors with self-aligned contacts and the resulting structures
GLOBALFOUNDRIES INC28 citations94
US9812324B1Nov 7, 2017
Methods to control fin tip placement
GLOBALFOUNDRIES INC4 citations73
US9780002B1Oct 3, 2017
Threshold voltage and well implantation method for semiconductor devices
GLOBALFOUNDRIES INC2 citations72
US10566328B2Feb 18, 2020
Integrated circuit products with gate structures positioned above elevated isolation structures
GLOBALFOUNDRIES INC0 citations33