Inventor
LIU KUANG
US11 patents
⚠️ This page may combine multiple inventors who share the name “LIU KUANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
10 patentsUS10455685B1Oct 22, 2019
Electronic device, socket, and spacer to alter socket profile
INTEL CORP12 citations78
US12238892B2Feb 25, 2025
Immersion cooling for integrated circuit devices
INTEL CORP3 citations72
US11464139B2Oct 4, 2022
Conformable heat sink interface with a high thermal conductivity
INTEL CORP3 citations71
US12127363B2Oct 22, 2024
Compression mounted technology (CMT) socket retention mechanisms to board or interposer
INTEL CORP0 citations60
US11569596B2Jan 31, 2023
Pressure features to alter the shape of a socket
INTEL CORP0 citations53
US12009612B2Jun 11, 2024
Dual-sided socket device with corrugation structures and shield structures
INTEL CORP0 citations50
US10499461B2Dec 3, 2019
Thermal head with a thermal barrier for integrated circuit die processing
INTEL CORP0 citations50
US10044115B2Aug 7, 2018
Universal linear edge connector
INTEL CORP1 citations50
US9603276B2Mar 21, 2017
Electronic assembly that includes a plurality of electronic packages
INTEL CORP1 citations50
US11158969B2Oct 26, 2021
Connectors for integrated circuit packages
INTEL CORP0 citations43