Inventor

WHITE ERIC J

US51 patents

⚠️ This page may combine multiple inventors who share the name “WHITE ERIC J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WHITE ERIC J

IBM

Process for producing crackstops on semiconductor devices and devices containing the crackstops

Microcavity structures, fabrication processes, and applications thereof

Reduction of foreign particulate matter on semiconductor wafers

Integrated BEOL thin film resistor

Self-aligned copper silicide formation for improved adhesion/electromigration

Microcavity structures, fabrication processes, and applications thereof

Chemical mechanical polishing slurry and method for polishing metal/oxide layers

Wafer edge cleaning

Personalized area leadframe coining or half etching for reduced mechanical stress at device edge

Method for reworking copper metallurgy in semiconductor devices

Integrated BEOL thin film resistor

Copper wire and dielectric with air gaps

Semiconductor structures having low resistance paths throughout a wafer

Semiconductor structures having low resistance paths throughout a wafer

Semiconductor structures having low resistance paths throughout a wafer

Chemical-mechanical-polishing slurry and method for polishing metal/oxide layers

Copper wire and dielectric with air gaps

Detection of hard mask remaining on a surface of an insulating layer

Personalized area leadframe coining or half etching for reduced mechanical stress at device edge

Planar cavity MEMS and related structures, methods of manufacture and design structures

Micro-electro-mechanical system (MEMS) structures and design structures

Copper wire and dielectric with air gaps

Semiconductor structures with metal lines

Chemical mechanical polishing method

Solution for forming polishing slurry, polishing slurry and related methods

Self-aligned copper silicide formation for improved adhesion/electromigration

Semiconductor structures having low resistance paths throughout a wafer

Semiconductor structures having low resistance paths throughout a wafer

Semiconductor structures having low resistance paths throughout a wafer

Micro-electro-mechanical system (MEMS) structures and design structures

Micro-electro-mechanical system (MEMS) structures and design structures

Micro-electro-mechanical system (MEMS) structures and design structures

Micro-Electro-Mechanical System (MEMS) structures and design structures

Method for forming micro-electro-mechanical system (MEMS) beam structure

Micro-electro-mechanical system (MEMS) structures and design structures

Micro-electro-mechanical system (MEMS) structures and design structures

GLOBALFOUNDRIES INC

Methods for selective reverse mask planarization and interconnect structures formed thereby

Slurry for chemical-mechanical polishing of metals and use thereof

Integrated circuit and interconnect, and method of fabricating same

BATES GRAHAM M

Slurry for chemical-mechanical polishing of metals and use thereof

Slurry for chemical-mechanical polishing of copper and use thereof

Slurryless mechanical planarization for substrate reclamation

COMEAU JOSEPH K V

Solution for forming polishing slurry, polishing slurry and related methods

Solution for forming polishing slurry, polishing slurry and related methods

HERRIN RUSSELL T

Planar cavity MEMS and related structures, methods of manufacture and design structures

CHINTHAKINDI ANIL K

Integrated BEOL thin film resistor

DANG DINH

Planar cavity MEMS and related structures, methods of manufacture and design structures

ANDERSON FELIX P

Method of electrolytic plating and semiconductor device fabrication

MCDEVITT THOMAS L

CMP method

HE ZHONG-XIANG

Methods for selective reverse mask planarization and interconnect structures formed thereby