Inventor · disambiguated record
Chanhoon Ko
Also filed as: KO CHANHOON
5 granted patents·4 pending applications·174 citations·filing 2010–2024
80Inventor score
Top patents by PatentIndex Score
9 records- 0194US8217502B2Integrated circuit packaging system with multipart conductive pillars and method of manufacture thereofKO CHANHOON·Filed 2010·Granted Jul 10, 2012·144 cites·20 claims
- 0289US8455300B2Integrated circuit package system with embedded die superstructure and method of manufacture thereofCHI HEEJO·Filed 2010·Granted Jun 4, 2013·12 cites·14 claims
- 0386US8304296B2Semiconductor packaging system with multipart conductive pillars and method of manufacture thereofKO CHANHOON·Filed 2010·Granted Nov 6, 2012·13 cites·20 claims
- 0476US8530277B2Integrated circuit packaging system with package on package support and method of manufacture thereofKO CHANHOON·Filed 2011·Granted Sep 10, 2013·5 cites·15 claims
- 0558US2025185180A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 0657US2024292529A1Circuit board and method of fabricating circuit boardSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 0756US2024170420A1Substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 0856US2024170330A1Substrate and manufacturing method for the sameSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 0942US9054098B2Integrated circuit packaging system with redistribution layer and method of manufacture thereofCHO NAMJU·Filed 2011·Granted Jun 9, 2015·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →