P

Inventor

AMADOR GONZALO

US30 patents
⚠️ This page may combine multiple inventors who share the name “AMADOR GONZALO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TEXAS INSTRUMENTS INC

20 patents
US6800555B2Oct 5, 2004

Wire bonding process for copper-metallized integrated circuits

TEXAS INSTRUMENTS INC185 citations97
US5201453AApr 13, 1993

Linear, direct-drive microelectronic bonding apparatus and method

TEXAS INSTRUMENTS INC54 citations96
US5783025AJul 21, 1998

Optical diebonding for semiconductor devices

TEXAS INSTRUMENTS INC63 citations95
US6432744B1Aug 13, 2002

Wafer-scale assembly of chip-size packages

TEXAS INSTRUMENTS INC62 citations92
US6245583B1Jun 12, 2001

Low stress method and apparatus of underfilling flip-chip electronic devices

TEXAS INSTRUMENTS INC49 citations92
US5114066AMay 19, 1992

Voice coil programmable wire tensioner

TEXAS INSTRUMENTS INC59 citations91
US6303407B1Oct 16, 2001

Method for the transfer of flux coated particles to a substrate

TEXAS INSTRUMENTS INC16 citations84
US6041994AMar 28, 2000

Rapid and selective heating method in integrated circuit package assembly by means of tungsten halogen light source

TEXAS INSTRUMENTS INC16 citations83
US4978050ADec 18, 1990

Damped optics tube assembly

TEXAS INSTRUMENTS INC7 citations74
US6234374B1May 22, 2001

Rapid and selective heating method in integrated circuit package assembly by means of tungsten halogen light source

TEXAS INSTRUMENTS INC14 citations72
US6226452B1May 1, 2001

Radiant chamber for simultaneous rapid die attach and lead frame embed for ceramic packaging

TEXAS INSTRUMENTS INC8 citations71
US6069342AMay 30, 2000

Automated multiple lead frame strip radiant die attach material curing apparatus

TEXAS INSTRUMENTS INC10 citations71
US7138726B2Nov 21, 2006

Protective interleaf for stacked wafer shipping

TEXAS INSTRUMENTS INC8 citations69
US6926150B2Aug 9, 2005

Protective interleaf for stacked wafer shipping

TEXAS INSTRUMENTS INC11 citations69
US5993591ANov 30, 1999

Coring of leadframes in carriers via radiant heat source

TEXAS INSTRUMENTS INC9 citations69
US7071013B2Jul 4, 2006

Fixture and method for uniform electroless metal deposition on integrated circuit bond pads

TEXAS INSTRUMENTS INC2 citations62
US6234296B1May 22, 2001

System for positioning a carrier relative to a travel path

TEXAS INSTRUMENTS INC1 citations60
US6227353B1May 8, 2001

System for applying a rotary force to strips of varying widths

TEXAS INSTRUMENTS INC2 citations60
US6940167B2Sep 6, 2005

Variable cross-section plated mushroom with stud for bumping

TEXAS INSTRUMENTS INC4 citations57
US6750134B2Jun 15, 2004

Variable cross-section plated mushroom with stud for bumping

TEXAS INSTRUMENTS INC0 citations46

OMNIPROBE INC

4 patents

ZAYKOVA-FELDMAN LYUDMILA

3 patents

OMNIPROBE IN C

1 patent

OXFORD INSTR NANOTECHNOLOGY TOOLS LTD

1 patent

AMADOR GONZALO

1 patent