Optical diebonding for semiconductor devices

Abstract

Semiconductor die attach occurs by bonding the semiconductor die to a support member such as a lead frame. An optical heat source provides heat for bonding the die attach material. An exhaust system removes vapors from the die attach material during bonding. A tungsten halogen lamp is an exemplary optical heat source. An air amplifier is exemplary to provide exhaust pressure. An exhaust manifold having a plurality of screens spreads the exhaust pressure over the width of the lead frame. A gas shower disposed over the lead frame aids in removing vapors.

What is claimed is: 
     
       1. An apparatus for curing an polymer die attach material to adhere a semiconductor die to a lead frame, comprising: a near infrared lamp;   a reflector to direct emissions from the near infrared lamp across the width of the lead frame;   a beltless processing station including a lead frame track rail disposed under the lamp to retain the lead frame having the semiconductor die adhered thereto by the polymer die attach material, the lead frame track rail supporting the lead frame only on the sides that define the width of the lead frame; and   an exhaust system in fluid communication with said processing station to remove outgassing from the polymer die attach material, the exhaust system including a diffuser screen to equalize exhaust vacuum across the width of the lead frame.   
     
     
       2. The apparatus of claim 1 further comprising a gas shower disposed over the lead frame track rail to direct a gas towards the semiconductor die. 
     
     
       3. The apparatus of claim 2 wherein the exhaust system comprises a nonelectrical exhaust system. 
     
     
       4. The apparatus of claim 3 wherein the nonelectrical exhaust system comprises: a diffuser manifold having a plurality of apertures disposed underneath the lead frame track rail;   a plurality of hoses connected to the plurality of apertures;   an amplifier manifold connected to the plurality of hoses; and   an air amplifier connected to the amplifier manifold.