Inventor · disambiguated record
Gonzalo Amador
Also filed as: AMADOR GONZALO
30 granted patents·12 pending applications·651 citations·filing 1989–2024
97Inventor score
Files withTEXAS INSTRUMENTS INC20OMNIPROBE INC7ZAYKOVA-FELDMAN LYUDMILA3AMADOR GONZALO2MOORE THOMAS M1
Top patents by PatentIndex Score
42 records- 0198US6800555B2Wire bonding process for copper-metallized integrated circuitsTEXAS INSTRUMENTS INC·Filed 2001·Granted Oct 5, 2004·185 cites·9 claims
- 0293US8227781B2Variable-tilt specimen holder and method and for monitoring milling in a charged-particle instrumentZAYKOVA-FELDMAN LYUDMILA·Filed 2010·Granted Jul 24, 2012·25 cites·8 claims
- 0387US7834315B2Method for STEM sample inspection in a charged particle beam instrumentOMNIPROBE INC·Filed 2008·Granted Nov 16, 2010·8 cites·12 claims
- 0486US8247768B2Method for stem sample inspection in a charged particle beam instrumentZAYKOVA-FELDMAN LYUDMILA·Filed 2010·Granted Aug 21, 2012·6 cites·8 claims
- 0584US7644637B2Method and apparatus for transfer of samples in a controlled environmentOMNIPROBE INC·Filed 2007·Granted Jan 12, 2010·20 cites·25 claims
- 0683US5783025AOptical diebonding for semiconductor devicesTEXAS INSTRUMENTS INC·Filed 1996·Granted Jul 21, 1998·63 cites·4 claims
- 0780US7138726B2Protective interleaf for stacked wafer shippingTEXAS INSTRUMENTS INC·Filed 2005·Granted Nov 21, 2006·8 cites·9 claims
- 0880US6432744B1Wafer-scale assembly of chip-size packagesTEXAS INSTRUMENTS INC·Filed 1998·Granted Aug 13, 2002·62 cites·9 claims
- 0979US7935937B2Method of forming TEM sample holderOMNIPROBE IN C·Filed 2009·Granted May 3, 2011·7 cites·30 claims
- 1076US9349573B2Total release method for sample extraction in an energetic-beam instrumentOXFORD INSTR NANOTECHNOLOGY TOOLS LTD·Filed 2015·Granted May 24, 2016·2 cites·21 claims
- 1176US6245583B1Low stress method and apparatus of underfilling flip-chip electronic devicesTEXAS INSTRUMENTS INC·Filed 1999·Granted Jun 12, 2001·49 cites·11 claims
- 1276US5201453ALinear, direct-drive microelectronic bonding apparatus and methodTEXAS INSTRUMENTS INC·Filed 1991·Granted Apr 13, 1993·54 cites·12 claims
- 1375US5114066AVoice coil programmable wire tensionerTEXAS INSTRUMENTS INC·Filed 1990·Granted May 19, 1992·59 cites·17 claims
- 1469US8168949B2Method for stem sample inspection in a charged particle beam instrumentZAYKOVA-FELDMAN LYUDMILA·Filed 2010·Granted May 1, 2012·1 cites·5 claims
- 1566US6926150B2Protective interleaf for stacked wafer shippingTEXAS INSTRUMENTS INC·Filed 2003·Granted Aug 9, 2005·11 cites·9 claims
- 1665US8288740B2Method for preparing specimens for atom probe analysis and specimen assemblies made therebyAMADOR GONZALO·Filed 2008·Granted Oct 16, 2012·2 cites·23 claims
- 1764USRE46350EMethod for stem sample inspection in a charged particle beam instrumentOMNIPROBE INC·Filed 2014·Granted Mar 28, 2017·0 cites·10 claims
- 1861US2025379025A1Optical Probe System for the Electron MicroscopeWAVIKS INC·Filed 2024·Application pending·0 cites
- 1955US6303407B1Method for the transfer of flux coated particles to a substrateTEXAS INSTRUMENTS INC·Filed 1999·Granted Oct 16, 2001·16 cites·11 claims
- 2055US2011204226A1Apparatus for stem sample inspection in a charged particle beam instrumentOMNIPROBE INC·Filed 2011·Application pending·0 cites
- 2154US6940167B2Variable cross-section plated mushroom with stud for bumpingTEXAS INSTRUMENTS INC·Filed 2004·Granted Sep 6, 2005·4 cites·4 claims
- 2254US2011017922A1Variable-tilt tem specimen holder for charged-particle beam instrumentsOMNIPROBE INC·Filed 2009·Application pending·0 cites
- 2353US2010025580A1Grid holder for stem analysis in a charged particle instrumentOMNIPROBE INC·Filed 2009·Application pending·0 cites
- 2452US2006219919A1TEM sample holder and method of forming sameMOORE THOMAS M·Filed 2006·Application pending·0 cites
- 2550US6234374B1Rapid and selective heating method in integrated circuit package assembly by means of tungsten halogen light sourceTEXAS INSTRUMENTS INC·Filed 1999·Granted May 22, 2001·14 cites·14 claims
- 2649US7071013B2Fixture and method for uniform electroless metal deposition on integrated circuit bond padsTEXAS INSTRUMENTS INC·Filed 2003·Granted Jul 4, 2006·2 cites·11 claims
- 2749US6227353B1System for applying a rotary force to strips of varying widthsTEXAS INSTRUMENTS INC·Filed 2000·Granted May 8, 2001·2 cites·4 claims
- 2849US6041994ARapid and selective heating method in integrated circuit package assembly by means of tungsten halogen light sourceTEXAS INSTRUMENTS INC·Filed 1997·Granted Mar 28, 2000·16 cites·6 claims
- 2947US8054558B2Multiple magnification optical system with single objective lensOMNIPROBE INC·Filed 2010·Granted Nov 8, 2011·0 cites·12 claims
- 3045US6234296B1System for positioning a carrier relative to a travel pathTEXAS INSTRUMENTS INC·Filed 2000·Granted May 22, 2001·1 cites·6 claims
- 3145US6069342AAutomated multiple lead frame strip radiant die attach material curing apparatusTEXAS INSTRUMENTS INC·Filed 1997·Granted May 30, 2000·10 cites·10 claims
- 3241US6750134B2Variable cross-section plated mushroom with stud for bumpingTEXAS INSTRUMENTS INC·Filed 2003·Granted Jun 15, 2004·0 cites·9 claims
- 3341US2005106851A1Wire bonding process for copper-metallized integrated circuitsFiled 2004·Application pending·0 cites
- 3440US2005217574A1Fixture and method for uniform electroless metal deposition on integrated circuit bond padsAMADOR GONZALO·Filed 2005·Application pending·0 cites
- 3538US6226452B1Radiant chamber for simultaneous rapid die attach and lead frame embed for ceramic packagingTEXAS INSTRUMENTS INC·Filed 1998·Granted May 1, 2001·8 cites·12 claims
- 3638US2003071319A1Structure and method for bond pads of copper-metallized integrated circuitsFiled 2002·Application pending·0 cites
- 3738US2001047944A1Fixture and method for uniform electroless metal deposition on integrated circuit bond padsFiled 2001·Application pending·0 cites
- 3837US5993591ACoring of leadframes in carriers via radiant heat sourceTEXAS INSTRUMENTS INC·Filed 1997·Granted Nov 30, 1999·9 cites·22 claims
- 3937US4978050ADamped optics tube assemblyTEXAS INSTRUMENTS INC·Filed 1989·Granted Dec 18, 1990·7 cites·15 claims
- 4037US2001033020A1Structure and method for bond pads of copper-metallized integrated circuitsFiled 2001·Application pending·0 cites
- 4134US2003107137A1Micromechanical device contact terminals free of particle generationFiled 2001·Application pending·0 cites
- 4233US2004007779A1Wafer-level method for fine-pitch, high aspect ratio chip interconnectFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →