P

Inventor

CHEN FEN

US98 patents
⚠️ This page may combine multiple inventors who share the name “CHEN FEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

33 patents
US8053814B2Nov 8, 2011

On-chip embedded thermal antenna for chip cooling

IBM44 citations98
US8847401B2Sep 30, 2014

Semiconductor structure incorporating a contact sidewall spacer with a self-aligned airgap and a method of forming the semiconductor structure

IBM22 citations93
US7571637B2Aug 11, 2009

Design structure for an on-chip real-time moisture sensor for and method of detecting moisture ingress in an integrated circuit chip

IBM20 citations93
US6790744B2Sep 14, 2004

Monolithically integrated solid-state sige thermoelectric energy converter for high speed and low power circuits

IBM19 citations93
US6788093B2Sep 7, 2004

Methodology and apparatus using real-time optical signal for wafer-level device dielectrical reliability studies

IBM131 citations93
US6639242B1Oct 28, 2003

Monolithically integrated solid-state SiGe thermoelectric energy converter for high speed and low power circuits

IBM29 citations93
US7381981B2Jun 3, 2008

Phase-change TaN resistor based triple-state/multi-state read only memory

IBM18 citations92
US10324056B2Jun 18, 2019

Moisture detection and ingression monitoring systems and methods of manufacture

IBM3 citations84
US10309919B2Jun 4, 2019

Moisture detection and ingression monitoring systems and methods of manufacture

IBM5 citations84
US10126260B2Nov 13, 2018

Moisture detection and ingression monitoring systems and methods of manufacture

IBM5 citations84
US9812359B2Nov 7, 2017

Thru-silicon-via structures

IBM6 citations84
US8779491B2Jul 15, 2014

3D via capacitor with a floating conductive plate for improved reliability

IBM5 citations84
US7345503B2Mar 18, 2008

Method and apparatus for impedance matching in transmission circuits using tantalum nitride resistor devices

IBM13 citations84
US9891261B2Feb 13, 2018

Electromigration monitor

IBM6 citations83
US9159671B2Oct 13, 2015

Copper wire and dielectric with air gaps

IBM5 citations83
US7084483B2Aug 1, 2006

Trench type buried on-chip precision programmable resistor

IBM10 citations74
US10545110B2Jan 28, 2020

Moisture detection and ingression monitoring systems and methods of manufacture

IBM2 citations73
US9093503B1Jul 28, 2015

Semiconductor chip with a dual damascene wire and through-substrate via (TSV) structure

IBM4 citations73
US8362794B2Jan 29, 2013

Method and system for assessing reliability of integrated circuit

IBM5 citations73
US7768815B2Aug 3, 2010

Optoelectronic memory devices

IBM5 citations73
US9613853B2Apr 4, 2017

Copper wire and dielectric with air gaps

IBM2 citations72
US9711464B2Jul 18, 2017

Semiconductor chip with anti-reverse engineering function

IBM3 citations69
US9287345B2Mar 15, 2016

Semiconductor structure with thin film resistor and terminal bond pad

IBM2 citations63
US8609504B2Dec 17, 2013

3D via capacitor with a floating conductive plate for improved reliability

IBM4 citations63
US7880158B2Feb 1, 2011

Phase-change TaN resistor based triple-state/multi-state read only memory

IBM2 citations63
US7795679B2Sep 14, 2010

Device structures with a self-aligned damage layer and methods for forming such device structures

IBM5 citations63
US7715248B2May 11, 2010

Phase-change TaN resistor based triple-state/multi-state read only memory

IBM3 citations63
US7601602B2Oct 13, 2009

Trench type buried on-chip precision programmable resistor

IBM2 citations63
US7500208B2Mar 3, 2009

Non-destructive evaluation of microstructure and interface roughness of electrically conducting lines in semiconductor integrated circuits in deep sub-micron regime

IBM2 citations63
US6794706B2Sep 21, 2004

Applications of space-charge-limited conduction induced current increase in nitride-oxide dielectric capacitors: voltage regulator for power supply system and others

IBM2 citations63
US10900923B2Jan 26, 2021

Moisture detection and ingression monitoring systems and methods of manufacture

IBM0 citations62
US9404953B2Aug 2, 2016

Structures and methods for monitoring dielectric reliability with through-silicon vias

IBM2 citations62
US7998828B2Aug 16, 2011

Method of forming metal ion transistor

IBM2 citations62

CHEN FEN

7 patents

UNIV NINGBO

3 patents

HONGFUJIN PREC IND SHENZHEN

2 patents

GLOBALFOUNDRIES INC

2 patents

YANG CHIH-CHAO

1 patent

VOYAGER THERAPEUTICS INC

1 patent

INDIUM CORP

1 patent

Showing the top 50 of 98 patents by PatentIndex Score.