Inventor
CHEN FEN
US98 patents
⚠️ This page may combine multiple inventors who share the name “CHEN FEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
33 patentsUS8053814B2Nov 8, 2011
On-chip embedded thermal antenna for chip cooling
IBM44 citations98
US8847401B2Sep 30, 2014
Semiconductor structure incorporating a contact sidewall spacer with a self-aligned airgap and a method of forming the semiconductor structure
IBM22 citations93
US7571637B2Aug 11, 2009
Design structure for an on-chip real-time moisture sensor for and method of detecting moisture ingress in an integrated circuit chip
IBM20 citations93
US6790744B2Sep 14, 2004
Monolithically integrated solid-state sige thermoelectric energy converter for high speed and low power circuits
IBM19 citations93
US6788093B2Sep 7, 2004
Methodology and apparatus using real-time optical signal for wafer-level device dielectrical reliability studies
IBM131 citations93
US6639242B1Oct 28, 2003
Monolithically integrated solid-state SiGe thermoelectric energy converter for high speed and low power circuits
IBM29 citations93
US7381981B2Jun 3, 2008
Phase-change TaN resistor based triple-state/multi-state read only memory
IBM18 citations92
US10324056B2Jun 18, 2019
Moisture detection and ingression monitoring systems and methods of manufacture
IBM3 citations84
US10309919B2Jun 4, 2019
Moisture detection and ingression monitoring systems and methods of manufacture
IBM5 citations84
US10126260B2Nov 13, 2018
Moisture detection and ingression monitoring systems and methods of manufacture
IBM5 citations84
US9812359B2Nov 7, 2017
Thru-silicon-via structures
IBM6 citations84
US8779491B2Jul 15, 2014
3D via capacitor with a floating conductive plate for improved reliability
IBM5 citations84
US7345503B2Mar 18, 2008
Method and apparatus for impedance matching in transmission circuits using tantalum nitride resistor devices
IBM13 citations84
US9891261B2Feb 13, 2018
Electromigration monitor
IBM6 citations83
US9159671B2Oct 13, 2015
Copper wire and dielectric with air gaps
IBM5 citations83
US7084483B2Aug 1, 2006
Trench type buried on-chip precision programmable resistor
IBM10 citations74
US10545110B2Jan 28, 2020
Moisture detection and ingression monitoring systems and methods of manufacture
IBM2 citations73
US9093503B1Jul 28, 2015
Semiconductor chip with a dual damascene wire and through-substrate via (TSV) structure
IBM4 citations73
US8362794B2Jan 29, 2013
Method and system for assessing reliability of integrated circuit
IBM5 citations73
US7768815B2Aug 3, 2010
Optoelectronic memory devices
IBM5 citations73
US9613853B2Apr 4, 2017
Copper wire and dielectric with air gaps
IBM2 citations72
US9711464B2Jul 18, 2017
Semiconductor chip with anti-reverse engineering function
IBM3 citations69
US9287345B2Mar 15, 2016
Semiconductor structure with thin film resistor and terminal bond pad
IBM2 citations63
US8609504B2Dec 17, 2013
3D via capacitor with a floating conductive plate for improved reliability
IBM4 citations63
US7880158B2Feb 1, 2011
Phase-change TaN resistor based triple-state/multi-state read only memory
IBM2 citations63
US7795679B2Sep 14, 2010
Device structures with a self-aligned damage layer and methods for forming such device structures
IBM5 citations63
US7715248B2May 11, 2010
Phase-change TaN resistor based triple-state/multi-state read only memory
IBM3 citations63
US7601602B2Oct 13, 2009
Trench type buried on-chip precision programmable resistor
IBM2 citations63
US7500208B2Mar 3, 2009
Non-destructive evaluation of microstructure and interface roughness of electrically conducting lines in semiconductor integrated circuits in deep sub-micron regime
IBM2 citations63
US6794706B2Sep 21, 2004
Applications of space-charge-limited conduction induced current increase in nitride-oxide dielectric capacitors: voltage regulator for power supply system and others
IBM2 citations63
US10900923B2Jan 26, 2021
Moisture detection and ingression monitoring systems and methods of manufacture
IBM0 citations62
US9404953B2Aug 2, 2016
Structures and methods for monitoring dielectric reliability with through-silicon vias
IBM2 citations62
US7998828B2Aug 16, 2011
Method of forming metal ion transistor
IBM2 citations62
CHEN FEN
7 patentsUS8563336B2Oct 22, 2013
Method for forming thin film resistor and terminal bond pad simultaneously
CHEN FEN18 citations92
US5210951AMay 18, 1993
Trisector
CHEN FEN8 citations74
US8890556B2Nov 18, 2014
Real-time on-chip EM performance monitoring
CHEN FEN6 citations70
US8569888B2Oct 29, 2013
Wiring structure and method of forming the structure
CHEN FEN3 citations63
US8497203B2Jul 30, 2013
Semiconductor structures and methods of manufacture
CHEN FEN3 citations63
US8294505B2Oct 23, 2012
Stackable programmable passive device and a testing method
CHEN FEN4 citations63
US8237339B2Aug 7, 2012
LED illuminating device
CHEN FEN5 citations63
UNIV NINGBO
3 patentsUS9460501B1Oct 4, 2016
Objective assessment method for stereoscopic video quality based on wavelet transform
UNIV NINGBO8 citations82
US10368051B2Jul 30, 2019
3D-HEVC inter-frame information hiding method based on visual perception
UNIV NINGBO7 citations71
US10210433B2Feb 19, 2019
Method for evaluating quality of tone-mapping image based on exposure analysis
UNIV NINGBO1 citations62
HONGFUJIN PREC IND SHENZHEN
2 patentsGLOBALFOUNDRIES INC
2 patentsYANG CHIH-CHAO
1 patentVOYAGER THERAPEUTICS INC
1 patentINDIUM CORP
1 patentShowing the top 50 of 98 patents by PatentIndex Score.