P

Inventor

SHIH SHENG-HUNG

TW65 patents
⚠️ This page may combine multiple inventors who share the name “SHIH SHENG-HUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

48 patents
US9172036B2Oct 27, 2015

Top electrode blocking layer for RRAM device

TAIWAN SEMICONDUCTOR MFG CO LTD29 citations98
US10008662B2Jun 26, 2018

Perpendicular magnetic tunneling junction (MTJ) for improved magnetoresistive random-access memory (MRAM) process

TAIWAN SEMICONDUCTOR MFG CO LTD53 citations94
US9577009B1Feb 21, 2017

RRAM cell with PMOS access transistor

TAIWAN SEMICONDUCTOR MFG CO LTD29 citations94
US9553265B1Jan 24, 2017

RRAM device with data storage layer having increased height

TAIWAN SEMICONDUCTOR MFG CO LTD33 citations94
US9425392B2Aug 23, 2016

RRAM cell structure with laterally offset BEVA/TEVA

TAIWAN SEMICONDUCTOR MFG CO LTD13 citations93
US10249756B2Apr 2, 2019

Semiconductor device including memory and logic circuit having FETs with ferroelectric layer and manufacturing methods thereof

TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US9780302B2Oct 3, 2017

Top electrode for device structures in interconnect

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9112148B2Aug 18, 2015

RRAM cell structure with laterally offset BEVA/TEVA

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US9076522B2Jul 7, 2015

Memory cells breakdown protection

TAIWAN SEMICONDUCTOR MFG CO LTD12 citations84
US10566519B2Feb 18, 2020

Method for forming a flat bottom electrode via (BEVA) top surface for memory

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations83
US10497436B2Dec 3, 2019

Memory device and fabrication thereof

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations83
US11706930B2Jul 18, 2023

Semiconductor device and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11296099B2Apr 5, 2022

FeRAM decoupling capacitor

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11227872B2Jan 18, 2022

FeRAM MFM structure with selective electrode etch

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11183503B2Nov 23, 2021

Memory cell having top and bottom electrodes defining recesses

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US11004975B2May 11, 2021

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10862029B2Dec 8, 2020

Top electrode for device structures in interconnect

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10199575B2Feb 5, 2019

RRAM cell structure with laterally offset BEVA/TEVA

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10158072B1Dec 18, 2018

Step height reduction of memory element

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9941470B2Apr 10, 2018

RRAM device with data storage layer having increased height

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9773552B2Sep 26, 2017

RRAM cell with PMOS access transistor

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11751485B2Sep 5, 2023

Flat bottom electrode via (BEVA) top surface for memory

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US11017852B2May 25, 2021

Method of forming memory device

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10796759B2Oct 6, 2020

Method and apparatus for reading RRAM cell

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10311952B2Jun 4, 2019

Method and apparatus for reading RRAM cell

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US9934853B2Apr 3, 2018

Method and apparatus for reading RRAM cell

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US11723292B2Aug 8, 2023

RRAM cell structure with laterally offset BEVA/TEVA

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11195840B2Dec 7, 2021

Method and structures pertaining to improved ferroelectric random-access memory (FeRAM)

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US9444045B2Sep 13, 2016

Top electrode for device structures in interconnect

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US12593458B2Mar 31, 2026

Semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12457751B2Oct 28, 2025

Interfacial layer with high texture uniformity for ferroelectric layer enhancement

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12432929B2Sep 30, 2025

Ferroelectric memory device with blocking layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12419056B2Sep 16, 2025

Integrated circuit and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12369327B2Jul 22, 2025

MFM device with an enhanced bottom electrode

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12356630B2Jul 8, 2025

Semiconductor device and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12167611B2Dec 10, 2024

FeRAM MFM structure with selective electrode etch

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12114509B2Oct 8, 2024

FeRAM decoupling capacitor

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12082421B2Sep 3, 2024

Semiconductor device and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11856788B2Dec 26, 2023

Semiconductor device and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11849588B2Dec 19, 2023

Semiconductor device and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11844286B2Dec 12, 2023

Flat bottom electrode via (BEVA) top surface for memory

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11800720B2Oct 24, 2023

Memory cell having a top electrode interconnect arranged laterally from a recess

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11785777B2Oct 10, 2023

FeRAM MFM structure with selective electrode etch

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11751401B2Sep 5, 2023

Integrated circuit and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11723213B2Aug 8, 2023

Method and structures pertaining to improved ferroelectric random-access memory (FeRAM)

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11557609B2Jan 17, 2023

Integrated circuit structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11296116B2Apr 5, 2022

Semiconductor device and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11201281B2Dec 14, 2021

Method for forming a flat bottom electrode via (BEVA) top surface for memory

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

TAIWAN SEMICONDUCTOR MFG

2 patents

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