Inventor
SHIH SHENG-HUNG
TW65 patents
⚠️ This page may combine multiple inventors who share the name “SHIH SHENG-HUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
48 patentsUS9172036B2Oct 27, 2015
Top electrode blocking layer for RRAM device
TAIWAN SEMICONDUCTOR MFG CO LTD29 citations98
US10008662B2Jun 26, 2018
Perpendicular magnetic tunneling junction (MTJ) for improved magnetoresistive random-access memory (MRAM) process
TAIWAN SEMICONDUCTOR MFG CO LTD53 citations94
US9577009B1Feb 21, 2017
RRAM cell with PMOS access transistor
TAIWAN SEMICONDUCTOR MFG CO LTD29 citations94
US9553265B1Jan 24, 2017
RRAM device with data storage layer having increased height
TAIWAN SEMICONDUCTOR MFG CO LTD33 citations94
US9425392B2Aug 23, 2016
RRAM cell structure with laterally offset BEVA/TEVA
TAIWAN SEMICONDUCTOR MFG CO LTD13 citations93
US10249756B2Apr 2, 2019
Semiconductor device including memory and logic circuit having FETs with ferroelectric layer and manufacturing methods thereof
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US9780302B2Oct 3, 2017
Top electrode for device structures in interconnect
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9112148B2Aug 18, 2015
RRAM cell structure with laterally offset BEVA/TEVA
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US9076522B2Jul 7, 2015
Memory cells breakdown protection
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations84
US10566519B2Feb 18, 2020
Method for forming a flat bottom electrode via (BEVA) top surface for memory
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations83
US10497436B2Dec 3, 2019
Memory device and fabrication thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations83
US11706930B2Jul 18, 2023
Semiconductor device and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11296099B2Apr 5, 2022
FeRAM decoupling capacitor
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11227872B2Jan 18, 2022
FeRAM MFM structure with selective electrode etch
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11183503B2Nov 23, 2021
Memory cell having top and bottom electrodes defining recesses
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US11004975B2May 11, 2021
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10862029B2Dec 8, 2020
Top electrode for device structures in interconnect
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10199575B2Feb 5, 2019
RRAM cell structure with laterally offset BEVA/TEVA
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10158072B1Dec 18, 2018
Step height reduction of memory element
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9941470B2Apr 10, 2018
RRAM device with data storage layer having increased height
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9773552B2Sep 26, 2017
RRAM cell with PMOS access transistor
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11751485B2Sep 5, 2023
Flat bottom electrode via (BEVA) top surface for memory
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US11017852B2May 25, 2021
Method of forming memory device
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10796759B2Oct 6, 2020
Method and apparatus for reading RRAM cell
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10311952B2Jun 4, 2019
Method and apparatus for reading RRAM cell
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US9934853B2Apr 3, 2018
Method and apparatus for reading RRAM cell
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US11723292B2Aug 8, 2023
RRAM cell structure with laterally offset BEVA/TEVA
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11195840B2Dec 7, 2021
Method and structures pertaining to improved ferroelectric random-access memory (FeRAM)
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US9444045B2Sep 13, 2016
Top electrode for device structures in interconnect
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US12593458B2Mar 31, 2026
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12457751B2Oct 28, 2025
Interfacial layer with high texture uniformity for ferroelectric layer enhancement
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12432929B2Sep 30, 2025
Ferroelectric memory device with blocking layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12419056B2Sep 16, 2025
Integrated circuit and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12369327B2Jul 22, 2025
MFM device with an enhanced bottom electrode
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12356630B2Jul 8, 2025
Semiconductor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12167611B2Dec 10, 2024
FeRAM MFM structure with selective electrode etch
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12114509B2Oct 8, 2024
FeRAM decoupling capacitor
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12082421B2Sep 3, 2024
Semiconductor device and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11856788B2Dec 26, 2023
Semiconductor device and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11849588B2Dec 19, 2023
Semiconductor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11844286B2Dec 12, 2023
Flat bottom electrode via (BEVA) top surface for memory
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11800720B2Oct 24, 2023
Memory cell having a top electrode interconnect arranged laterally from a recess
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11785777B2Oct 10, 2023
FeRAM MFM structure with selective electrode etch
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11751401B2Sep 5, 2023
Integrated circuit and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11723213B2Aug 8, 2023
Method and structures pertaining to improved ferroelectric random-access memory (FeRAM)
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11557609B2Jan 17, 2023
Integrated circuit structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11296116B2Apr 5, 2022
Semiconductor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11201281B2Dec 14, 2021
Method for forming a flat bottom electrode via (BEVA) top surface for memory
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
TAIWAN SEMICONDUCTOR MFG
2 patentsShowing the top 50 of 65 patents by PatentIndex Score.