Inventor · disambiguated record
Yeo-Hoon Yoon
Also filed as: YOON YEO-HOON
7 granted patents·1 pending application·20 citations·filing 2008–2021
80Inventor score
Top patents by PatentIndex Score
8 records- 0186US11107783B2Wafer-level package including under bump metal layerSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 31, 2021·4 cites·18 claims
- 0282US11810878B2Wafer-level package including under bump metal layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 7, 2023·1 cites·14 claims
- 0382US10937771B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 2, 2021·3 cites·17 claims
- 0481US10347611B2Semiconductor packages having redistribution substrateSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 9, 2019·4 cites·19 claims
- 0574US7777308B2Integrated circuit packages including sinuous lead framesSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 17, 2010·6 cites·20 claims
- 0669US11862589B2Wafer-level package including under bump metal layerSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 2, 2024·0 cites·19 claims
- 0760US8448506B2Adhesion test method using elastic plateYOON YEO-HOON·Filed 2010·Granted May 28, 2013·2 cites·17 claims
- 0826US2017162555A1Solder composition and semiconductor package including the sameJo Junglae·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →