Inventor

HUANG YIWEI

DE11 patents

⚠️ This page may combine multiple inventors who share the name “HUANG YIWEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SIEMENS HEALTHCARE GMBH

4 patents

US12486533B2Dec 2, 2025

Direct RNA nanopore sequencing with help of a stem-loop reverse polynucleotide

SIEMENS HEALTHCARE GMBH0 citations59

US11505824B2Nov 22, 2022

Direct RNA nanopore sequencing with help of a stem-loop reverse polynucleotide

SIEMENS HEALTHCARE GMBH0 citations59

US11572593B2Feb 7, 2023

Amplification-integrated genetic material depletion of non-target organisms using differentially abundant k-mers

SIEMENS HEALTHCARE GMBH0 citations54

US11572554B2Feb 7, 2023

Target irrelevant guide RNA for CRISPR

SIEMENS HEALTHCARE GMBH0 citations36

KHANDIGE SHARMA DIVYA

1 patent

US10465231B2Nov 5, 2019

Method and apparatus for enriching pathogen DNA

KHANDIGE SHARMA DIVYA3 citations57

CHINA CHIPPACKING TECH CO LTD

1 patent

USD920265SMay 25, 2021

Integrated circuit package

CHINA CHIPPACKING TECH CO LTD0 citations53

QUALCOMM INC

1 patent

US12346259B1Jul 1, 2025

Cache resource prioritization for heterogeneous multi-processing (HMP) architecture

QUALCOMM INC1 citations50

BEIJING INSTITUTE TECH

1 patent

US11634146B2Apr 25, 2023

Method and system for integrated path planning and path tracking control of autonomous vehicle

BEIJING INSTITUTE TECH0 citations46

BEIJING XIAOMI MOBILE SOFTWARE CO LTD

1 patent

US11809683B2Nov 7, 2023

Display method, display device and storage medium

BEIJING XIAOMI MOBILE SOFTWARE CO LTD0 citations42

HUANG YIWEI

1 patent

US10494628B2Dec 3, 2019

Method and apparatus for enriching pathogen DNA

HUANG YIWEI0 citations35

GUANGDONG CHIPPACKING TECH CO LTD

1 patent

US11088053B2Aug 10, 2021

Encapsulation structure with high density, multiple sided and exposed leads and method for manufacturing the same

GUANGDONG CHIPPACKING TECH CO LTD0 citations29