Inventor
SHIM JONGBO
KR35 patents
Patents
35 patentsUS9425111B2Aug 23, 2016
Semiconductor package
SAMSUNG ELECTRONICS CO LTD28 citations94
US10361170B2Jul 23, 2019
Semiconductor package
SAMSUNG ELECTRONICS CO LTD11 citations82
US12388029B2Aug 12, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD3 citations74
US11152416B2Oct 19, 2021
Semiconductor package including a redistribution line
SAMSUNG ELECTRONICS CO LTD2 citations73
US12062605B2Aug 13, 2024
Semiconductor package including an interposer and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations72
US11367688B2Jun 21, 2022
Semiconductor package with interposer
SAMSUNG ELECTRONICS CO LTD2 citations72
US11367679B2Jun 21, 2022
Semiconductor package including an in interposer and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations72
US10748953B2Aug 18, 2020
Methods of forming redistribution lines and methods of manufacturing semiconductor devices using the same
SAMSUNG ELECTRONICS CO LTD2 citations72
US12033924B2Jul 9, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations71
US12261157B2Mar 25, 2025
Semiconductor device having package on package structure and method of manufacturing the semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations62
US11804477B2Oct 31, 2023
Semiconductor device having package on package structure and method of manufacturing the semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations62
US11798889B2Oct 24, 2023
Methods of manufacturing semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations62
US11658107B2May 23, 2023
Semiconductor package including an interposer and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US10978431B2Apr 13, 2021
Semiconductor package with connection substrate and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations62
US10923428B2Feb 16, 2021
Semiconductor package having second pad electrically connected through the interposer chip to the first pad
SAMSUNG ELECTRONICS CO LTD0 citations62
US10651224B2May 12, 2020
Semiconductor package including a redistribution line
SAMSUNG ELECTRONICS CO LTD1 citations62
US12261093B2Mar 25, 2025
Semiconductor packages having a dam structure
SAMSUNG ELECTRONICS CO LTD0 citations61
US12148729B2Nov 19, 2024
Semiconductor package structure having interposer substrate, and stacked semiconductor package structure including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12021036B2Jun 25, 2024
Semiconductor package including interposer and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11876083B2Jan 16, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11521934B2Dec 6, 2022
Semiconductor package including interposer and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11437293B2Sep 6, 2022
Semiconductor packages having a dam structure
SAMSUNG ELECTRONICS CO LTD0 citations61
US11728230B2Aug 15, 2023
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US12512398B2Dec 30, 2025
Semiconductor package having semiconductor chip positioned in cavity of cover wiring structure
SAMSUNG ELECTRONICS CO LTD0 citations51
US11948873B2Apr 2, 2024
Semiconductor package including a support solder ball
SAMSUNG ELECTRONICS CO LTD0 citations51
US11854989B2Dec 26, 2023
Semiconductor package substrate and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US10615213B2Apr 7, 2020
Methods of forming redistribution lines and methods of manufacturing semiconductor devices using the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US11710673B2Jul 25, 2023
Interposer and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US9112062B2Aug 18, 2015
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US11581263B2Feb 14, 2023
Semiconductor package, and package on package having the same
SAMSUNG ELECTRONICS CO LTD0 citations48
US11367714B2Jun 21, 2022
Semiconductor package device
SAMSUNG ELECTRONICS CO LTD0 citations48
US11404382B2Aug 2, 2022
Semiconductor package including an embedded semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations47
US12575413B2Mar 10, 2026
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations44
US11676949B2Jun 13, 2023
Semiconductor packages having supporting members
SAMSUNG ELECTRONICS CO LTD0 citations44
US10636760B2Apr 28, 2020
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations40