Inventor

LEE HYUNGMIN

KR36 patents

⚠️ This page may combine multiple inventors who share the name “LEE HYUNGMIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE HYUNGMIN

SAMSUNG ELECTRONICS CO LTD

Sound visualization method and apparatus of electronic device

Electronic cover with light animation

DC-DC buck converter and operating method thereof

DC-to-DC converter and integrated circuit including the same

DC-to-DC converter and integrated circuit including the same

Electronic apparatus and controlling method thereof

Electronic apparatus and controlling method thereof

Electronic device and method for reflecting screen on portion of flexible display on basis of flexible display shape

DC-DC converter and power device including the same

Method and electronic device for recognizing product

Electronic device and method for controlling the electronic device thereof

Electronic device and method of controlling display of screen thereof

Power switching circuit, a DC-DC converter including the same and a voltage conversion method

Electronic device and method for controlling application thereof

Electronic device and method of controlling display thereof

GLOBALWAFERS CO LTD

High resistivity single crystal silicon ingot and wafer having improved mechanical strength

Resistivity stabilization measurement of fat neck slabs for high resistivity and ultra-high resistivity single crystal silicon ingot growth

High resistivity single crystal silicon ingot and wafer having improved mechanical strength

High resistivity single crystal silicon ingot and wafer having improved mechanical strength

Methods for producing low oxygen silicon ingots

Methods for forming single crystal silicon ingots with improved resistivity control

Methods for producing a product ingot having low oxygen content

STATS CHIPPAC LTD

Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate

Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die

Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die

Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate

CHOI DAESIK

Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate

Semiconductor device and method of forming a stackable semiconductor package with vertically-oriented discrete electrical devices as interconnect structures

SUNEDISON SEMICONDUCTOR LTD

Methods for producing low oxygen silicon ingots

Methods for forming single crystal silicon ingots with improved resistivity control

CHI HEEJO

Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof

Integrated circuit packaging system with a stack package and method of manufacture thereof

GLOBAL WAFERS CO LTD

Sample rod growth and resistivity measurement during single crystal silicon ingot production

Methods for determining the resistivity of a polycrystalline silicon melt

PARK YEONGLM

Semiconductor device and method of forming 3D semiconductor package with semiconductor die stacked over semiconductor wafer

LEE HYUNGMIN

Integrated circuit packaging system with laser hole and method of manufacture thereof