P

Inventor

SHIOGA TAKESHI

JP66 patents
⚠️ This page may combine multiple inventors who share the name “SHIOGA TAKESHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUJITSU LTD

44 patents
US7161793B2Jan 9, 2007

Layer capacitor element and production process as well as electronic device

FUJITSU LTD52 citations96
US7227736B2Jun 5, 2007

Capacitor device and method of manufacturing the same

FUJITSU LTD34 citations93
US7172945B2Feb 6, 2007

Method of manufacturing thin film capacitor

FUJITSU LTD24 citations93
US7102367B2Sep 5, 2006

Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof

FUJITSU LTD34 citations93
US6882516B2Apr 19, 2005

Thin film capacitor and method of manufacturing the same

FUJITSU LTD21 citations93
US6853051B2Feb 8, 2005

Thin film capacitor and method of manufacturing the same

FUJITSU LTD35 citations93
US7863524B2Jan 4, 2011

Interposer and method for manufacturing the same

FUJITSU LTD24 citations92
US7670940B2Mar 2, 2010

Plating method, semiconductor device fabrication method and circuit board fabrication method

FUJITSU LTD26 citations92
US7355290B2Apr 8, 2008

Interposer and method for fabricating the same

FUJITSU LTD20 citations92
US7176556B2Feb 13, 2007

Semiconductor system-in-package

FUJITSU LTD33 citations92
US6624501B2Sep 23, 2003

Capacitor and semiconductor device

FUJITSU LTD21 citations92
US9711433B2Jul 18, 2017

Semiconductor device, method of manufacturing the same, and electronic device

FUJITSU LTD12 citations84
US9142476B2Sep 22, 2015

Semiconductor package, cooling mechanism and method for manufacturing semiconductor package

FUJITSU LTD7 citations84
US7940516B2May 10, 2011

Capacitor and electronic substrate including the same

FUJITSU LTD11 citations84
US7795739B2Sep 14, 2010

Semiconductor device, method of manufacturing the same

FUJITSU LTD11 citations84
US7745924B2Jun 29, 2010

Capacitor embedded in interposer, semiconductor device including the same, and method for manufacturing capacitor embedded in interposer

FUJITSU LTD8 citations84
US7614142B2Nov 10, 2009

Method for fabricating an interposer

FUJITSU LTD11 citations84
US7557014B2Jul 7, 2009

Semiconductor system-in-package

FUJITSU LTD12 citations84
US7466152B2Dec 16, 2008

Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof

FUJITSU LTD12 citations84
US7405366B2Jul 29, 2008

Interposer and electronic device fabrication method

FUJITSU LTD12 citations84
US7846852B2Dec 7, 2010

Method for manufacturing capacitor embedded in interposer

FUJITSU LTD6 citations74
US7793396B2Sep 14, 2010

Manufacturing method of capacitor

FUJITSU LTD7 citations74
US7339277B2Mar 4, 2008

Semiconductor device having passive component and support substrate with electrodes and through electrodes passing through support substrate

FUJITSU LTD8 citations74
US7251117B2Jul 31, 2007

Thin film capacitor and method of manufacturing the same

FUJITSU LTD4 citations74
US6975501B1Dec 13, 2005

Electronic device and method of applying voltage to capacitor

FUJITSU LTD8 citations74
US6894396B2May 17, 2005

Semiconductor device with capacitor

FUJITSU LTD10 citations74
US6873038B2Mar 29, 2005

Capacitor and semiconductor device and method for fabricating the semiconductor device

FUJITSU LTD7 citations74
US6803617B2Oct 12, 2004

Capacitor and method for fabricating the same

FUJITSU LTD12 citations74
US10624238B2Apr 14, 2020

Loop heat pipe and manufacturing method for loop heat pipe and electronic device

FUJITSU LTD2 citations73
US10420253B2Sep 17, 2019

Loop heat pipe, manufacturing method thereof, and electronic device

FUJITSU LTD2 citations73
US7298050B2Nov 20, 2007

Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same

FUJITSU LTD9 citations73
US11536518B2Dec 27, 2022

Fabrication method for loop heat pipe

FUJITSU LTD0 citations63
US11044830B2Jun 22, 2021

Loop heat pipe and electronic device

FUJITSU LTD1 citations63
US10881021B2Dec 29, 2020

Loop heat pipe and fabrication method therefor, and electronic device

FUJITSU LTD1 citations63
US8344386B2Jan 1, 2013

Laminated thin-film device, manufacturing method thereof, and circuit

FUJITSU LTD2 citations63
US8035981B2Oct 11, 2011

Semiconductor device and manufacturing method of the same

FUJITSU LTD3 citations63
US7937830B2May 10, 2011

Interposer and electronic device fabrication method

FUJITSU LTD5 citations63
US7867869B2Jan 11, 2011

Laminated thin-film device, manufacturing method thereof, and circuit

FUJITSU LTD4 citations63
US7832069B2Nov 16, 2010

Capacitor device and method of manufacturing the same

FUJITSU LTD4 citations63
US7778009B2Aug 17, 2010

Thin-film capacitor and method of manufacturing the same

FUJITSU LTD6 citations63
US7365327B2Apr 29, 2008

Electromagnetic radiation sensor and method for fabricating the same

FUJITSU LTD3 citations63
US7180119B2Feb 20, 2007

Capacitor and method for fabricating the same, and semiconductor device and method for fabricating the same

FUJITSU LTD3 citations63
US7161200B2Jan 9, 2007

Capacitive element and method of manufacturing the same

FUJITSU LTD5 citations63
US7026680B2Apr 11, 2006

Thin film capacitive element, method for producing same and electronic device

FUJITSU LTD6 citations63

SHIOGA TAKESHI

2 patents

SHINKO ELECTRIC IND CO

2 patents

OGATA SUSUMU

1 patent

UCHIDA HIROKI

1 patent

Showing the top 50 of 66 patents by PatentIndex Score.