Inventor

MURTUZA MASOOD

US42 patents

⚠️ This page may combine multiple inventors who share the name “MURTUZA MASOOD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MURTUZA MASOOD

TEXAS INSTRUMENTS INC

Fine pitch low-cost flip chip substrate

Built-up bump pad structure and method for same

Using a supporting structure to control collapse of a die towards a die pad during a reflow process for coupling the die to the die pad

Ball grid package with multiple power/ground planes

Adhesion by plasma conditioning of semiconductor chip surfaces

Dual carrier for joining IC die or wafers to TSV wafers

Bonding IC die to TSV wafers

Low stress ball grid array package

Direct attach chip scale package

Multi layer low cost cavity substrate fabrication for pop packages

Two-metal layer ball grid array and chip scale package having local interconnects used in wire-bonded and flip-chip semiconductor assembly

Adhesion by plasma conditioning of semiconductor chip

Solder cap application process on copper bump using solder powder film

Systems and methods for post-circuitization assembly

Method for contacting agglomerate terminals of semiconductor packages

Adhesion by plasma conditioning of semiconductor chip

Adhesion by plasma conditioning of semiconductor chip surfaces

Adhesion by plasma conditioning of semiconductor chip surfaces

Multi layer low cost cavity substrate fabrication for PoP packages

Support structure for low-k dielectrics

Fine pitch low cost flip chip substrate

Tape automated bonding package for a semiconductor chip employing corner member cross-slots

Fixture for test circuit board reliability testing

OCTAVO SYSTEMS LLC

Method for routing bond wires in system in a package (SiP) devices

Substrate for system in package (SIP) devices

Secure enclave system-in-package

EMI shield for molded packages

Configurable substrate and systems

Secure enclave system-in-package

EMI shield for molded packages

System in a package connectors

System in a package modifications

System in a package modifications

Service module for SIP devices

Circuit mounting structure and lead frame for system in package (SIP) devices

High performance module for SiP

System and method of assembling a system

DUNNE RAJIV

IC device having low resistance TSV comprising ground connection

IC device having low resistance TSV comprising ground connection

IC device having low resistance TSV comprising ground connection

BONIFIELD THOMAS D

Packaged electronic devices with face-up die having TSV connection to leads and die pad

EDWARDS DARVIN R

Semiconductor device having agglomerate terminals