Inventor
DUNNE RAJIV
US13 patents
⚠️ This page may combine multiple inventors who share the name “DUNNE RAJIV”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
5 patentsUS8017439B2Sep 13, 2011
Dual carrier for joining IC die or wafers to TSV wafers
TEXAS INSTRUMENTS INC26 citations92
US7915080B2Mar 29, 2011
Bonding IC die to TSV wafers
TEXAS INSTRUMENTS INC30 citations90
US9165873B1Oct 20, 2015
Semiconductor package having etched foil capacitor integrated into leadframe
TEXAS INSTRUMENTS INC10 citations83
US9373572B2Jun 21, 2016
Semiconductor package having etched foil capacitor integrated into leadframe
TEXAS INSTRUMENTS INC2 citations61
US9142496B1Sep 22, 2015
Semiconductor package having etched foil capacitor integrated into leadframe
TEXAS INSTRUMENTS INC0 citations40
DUNNE RAJIV
4 patentsUS8178976B2May 15, 2012
IC device having low resistance TSV comprising ground connection
DUNNE RAJIV18 citations91
US8313982B2Nov 20, 2012
Stacked die assemblies including TSV die
DUNNE RAJIV24 citations89
US8431481B2Apr 30, 2013
IC device having low resistance TSV comprising ground connection
DUNNE RAJIV4 citations61
US8436475B2May 7, 2013
IC device having low resistance TSV comprising ground connection
DUNNE RAJIV0 citations50