Inventor
LEONG CHEW WENG
SG3 patents
Patents
3 patentsUS6091140AJul 18, 2000
Thin chip-size integrated circuit package
TEXAS INSTRUMENTS INC114 citations95
US6468831B2Oct 22, 2002
Method of fabricating thin integrated circuit units
TEXAS INSTRUMENTS INC43 citations90
US6274929B1Aug 14, 2001
Stacked double sided integrated circuit package
TEXAS INSTRUMENTS INC35 citations90