Inventor
CHAN BOON PEW
SG7 patents
Patents
7 patentsUS6387729B2May 14, 2002
Method for adhering and sealing a silicon chip in an integrated circuit package
TEXAS INSTRUMENTS INC48 citations95
US6365833B1Apr 2, 2002
Integrated circuit package
TEXAS INSTRUMENTS INC70 citations95
US6177723B1Jan 23, 2001
Integrated circuit package and flat plate molding process for integrated circuit package
TEXAS INSTRUMENTS INC64 citations95
US6087203AJul 11, 2000
Method for adhering and sealing a silicon chip in an integrated circuit package
TEXAS INSTRUMENTS INC45 citations95
US5998860ADec 7, 1999
Double sided single inline memory module
TEXAS INSTRUMENTS INC82 citations95
US6468831B2Oct 22, 2002
Method of fabricating thin integrated circuit units
TEXAS INSTRUMENTS INC43 citations90
US6274929B1Aug 14, 2001
Stacked double sided integrated circuit package
TEXAS INSTRUMENTS INC35 citations90