P

Inventor

CHU YEN-CHANG

TW43 patents
⚠️ This page may combine multiple inventors who share the name “CHU YEN-CHANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

27 patents
US9437572B2Sep 6, 2016

Conductive pad structure for hybrid bonding and methods of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD227 citations99
US9490158B2Nov 8, 2016

Bond chuck, methods of bonding, and tool including bond chuck

TAIWAN SEMICONDUCTOR MFG CO LTD15 citations93
US10943940B2Mar 9, 2021

Image sensor comprising reflective guide layer and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10790189B2Sep 29, 2020

3D integrated circuit and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US10269857B2Apr 23, 2019

Image sensor comprising reflective guide layer and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10043705B2Aug 7, 2018

Memory device and method of forming thereof

TAIWAN SEMICONDUCTOR MFG CO LTD13 citations84
US9754813B2Sep 5, 2017

Bond chuck, methods of bonding, and tool including bond chuck

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9673239B1Jun 6, 2017

Image sensor device and method

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9576827B2Feb 21, 2017

Apparatus and method for wafer level bonding

TAIWAN SEMICONDUCTOR MFG CO LTD15 citations84
US11152426B2Oct 19, 2021

Memory device using an etch stop dielectric layer and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11024774B2Jun 1, 2021

Display device reflector having improved reflectivity

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10756222B2Aug 25, 2020

Backside illuminated photo-sensitive device with gradated buffer layer

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10350726B2Jul 16, 2019

Chemical mechanical polishing system and method

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10109756B2Oct 23, 2018

Backside illuminated photo-sensitive device with gradated buffer layer

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10090196B2Oct 2, 2018

3D integrated circuit and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10049901B2Aug 14, 2018

Apparatus and method for wafer level bonding

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9842816B2Dec 12, 2017

Conductive pad structure for hybrid bonding and methods of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11049767B2Jun 29, 2021

Semiconductor device and methods of manufacturing thereof

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US11855109B2Dec 26, 2023

Image sensor device and method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11611005B2Mar 21, 2023

Backside illuminated photo-sensitive device with gradated buffer layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11201183B2Dec 14, 2021

Image sensor device and method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US9698190B2Jul 4, 2017

Image sensor comprising reflective guide layer and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US10967479B2Apr 6, 2021

Chemical mechanical polishing system and method

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12456649B2Oct 28, 2025

Semiconductor device and methods of manufacturing thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10748948B2Aug 18, 2020

Image sensor device and method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10177106B2Jan 8, 2019

Conductive pad structure for hybrid bonding and methods of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10115896B1Oct 30, 2018

Semiconductor device and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52

PIXART IMAGING INC

12 patents

TAIWAN SEMICONDUCTOR MFG

3 patents

QING DING PREC ELECTRONICS HUAIAN CO LTD

1 patent