Inventor

WILKERSON BRETT P

US27 patents

⚠️ This page may combine multiple inventors who share the name “WILKERSON BRETT P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WILKERSON BRETT P

ADVANCED MICRO DEVICES INC

Scheme for enabling die reuse in 3D stacked products

Low temperature hybrid bonding

Offset-aligned three-dimensional integrated circuit

Hybrid bonded interconnect bridging

Molded chip package with anchor structures

Molded chip package with anchor structures

3D semiconductor package with die-mounted voltage regulator

Hybrid bonded interconnect bridging

Offset-aligned three-dimensional integrated circuit

Offset-aligned three-dimensional integrated circuit

Electronic device including dies and an interconnect coupled to the dies and processes of forming the same

Fanout module integrating a photonic integrated circuit

Arrangement and thermal management of 3D stacked dies

Fan-out package with reinforcing rivets

Fanout module integrating a photonic integrated circuit

Arrangement and thermal management of 3D stacked dies

Arrangement and thermal management of 3D stacked dies

Mixed density interconnect architectures using hybrid fan-out

Semiconductor chip device

Semiconductor package with annular package lid structure

UEHLING TRENT S

Packaged integrated circuit having large solder pads and method for forming

Semiconductor package structure having an air gap and method for forming

Semiconductor devices with compliant interconnects

FREESCALE SEMICONDUCTOR INC

Die level metal density gradient for improved flip chip package reliability

Integrated circuit having structural support for a flip-chip interconnect pad and method therefor

AGARWAL RAHUL

Stacked dies and dummy components for improved thermal performance

WUU JOHN

Arrangement and thermal management of 3D stacked dies