Inventor
SWAMINATHAN RAJA
US12 patents
Patents
12 patentsUS11911839B2Feb 27, 2024
Low temperature hybrid bonding
ADVANCED MICRO DEVICES INC5 citations73
US11830817B2Nov 28, 2023
Creating interconnects between dies using a cross-over die and through-die vias
ADVANCED MICRO DEVICES INC4 citations73
US12165981B2Dec 10, 2024
3D semiconductor package with die-mounted voltage regulator
ADVANCED MICRO DEVICES INC1 citations62
US12381127B2Aug 5, 2025
Semiconductor chip device integrating thermal pipes in three-dimensional packaging
ADVANCED MICRO DEVICES INC0 citations61
US12374645B2Jul 29, 2025
Electronic device including dies and an interconnect coupled to the dies and processes of forming the same
ADVANCED MICRO DEVICES INC0 citations61
US12276850B2Apr 15, 2025
Fanout module integrating a photonic integrated circuit
ADVANCED MICRO DEVICES INC0 citations61
US11709327B2Jul 25, 2023
Fanout module integrating a photonic integrated circuit
ADVANCED MICRO DEVICES INC0 citations61
US12525573B2Jan 13, 2026
Partitioning wafer processing and hybrid bonding of layers formed on different wafers for a semiconductor assembly
ADVANCED MICRO DEVICES INC0 citations56
US12519085B2Jan 6, 2026
Direct cooling for SoIC architectures
ADVANCED MICRO DEVICES INC0 citations55
US12588486B2Mar 24, 2026
Connecting semicondcutor device assembly components using interconnect dies with spacer component coupled to a portion of an interconnect die
ADVANCED MICRO DEVICES INC0 citations51
US12266611B2Apr 1, 2025
Mixed density interconnect architectures using hybrid fan-out
ADVANCED MICRO DEVICES INC0 citations51
US12278150B2Apr 15, 2025
Semiconductor package with annular package lid structure
ADVANCED MICRO DEVICES INC0 citations50