Inventor
HIRAMATSU YASUJI
JP55 patents
⚠️ This page may combine multiple inventors who share the name “HIRAMATSU YASUJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBIDEN CO LTD
48 patentsUS6507006B1Jan 14, 2003
Ceramic substrate and process for producing the same
IBIDEN CO LTD137 citations99
US6465763B1Oct 15, 2002
Ceramic heater
IBIDEN CO LTD112 citations99
US6929874B2Aug 16, 2005
Aluminum nitride sintered body, ceramic substrate, ceramic heater and electrostatic chuck
IBIDEN CO LTD69 citations98
US6891263B2May 10, 2005
Ceramic substrate for a semiconductor production/inspection device
IBIDEN CO LTD65 citations96
US6835895B1Dec 28, 2004
Printed wiring board and method for manufacturing the same
IBIDEN CO LTD48 citations96
US6677557B2Jan 13, 2004
Ceramic heater
IBIDEN CO LTD64 citations96
US6609297B1Aug 26, 2003
Method of manufacturing multilayer printed wiring board
IBIDEN CO LTD59 citations96
US6242079B1Jun 5, 2001
Printed wiring board and method for manufacturing the same
IBIDEN CO LTD67 citations96
US6251502B1Jun 26, 2001
Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler
IBIDEN CO LTD58 citations94
US6217988B1Apr 17, 2001
Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler
IBIDEN CO LTD38 citations94
US6010768AJan 4, 2000
Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler
IBIDEN CO LTD74 citations94
US7456372B2Nov 25, 2008
Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
IBIDEN CO LTD34 citations93
US7361849B2Apr 22, 2008
Printed wiring board and method for manufacturing the same
IBIDEN CO LTD16 citations93
US7127812B2Oct 31, 2006
Process for producing a multi-layer printed wiring board
IBIDEN CO LTD15 citations93
US7071551B2Jul 4, 2006
Device used to produce or examine semiconductors
IBIDEN CO LTD34 citations93
US6964812B2Nov 15, 2005
Carbon-containing aluminum nitride sintered compact and ceramic substrate for use in equipment for manufacturing or inspecting semiconductor
IBIDEN CO LTD20 citations93
US6960743B2Nov 1, 2005
Ceramic substrate for semiconductor manufacturing, and method of manufacturing the ceramic substrate
IBIDEN CO LTD32 citations93
US6900149B1May 31, 2005
Carbon-containing aluminum nitride sintered compact and ceramic substrate for use in equipment for manufacturing or inspecting semiconductor
IBIDEN CO LTD15 citations93
US6888106B2May 3, 2005
Ceramic heater
IBIDEN CO LTD19 citations93
US6815646B2Nov 9, 2004
Ceramic substrate for semiconductor manufacture/inspection apparatus, ceramic heater, electrostatic clampless holder, and substrate for wafer prober
IBIDEN CO LTD26 citations93
US6753601B2Jun 22, 2004
Ceramic substrate for semiconductor fabricating device
IBIDEN CO LTD31 citations93
US6731496B2May 4, 2004
Electrostatic chuck
IBIDEN CO LTD42 citations93
US6717116B1Apr 6, 2004
Semiconductor production device ceramic plate
IBIDEN CO LTD35 citations93
US6710307B2Mar 23, 2004
Ceramic heater
IBIDEN CO LTD35 citations93
US6586686B1Jul 1, 2003
Multilayer printed wiring board and method for manufacturing the same
IBIDEN CO LTD34 citations93
US6518513B1Feb 11, 2003
Single-sided circuit board and method for manufacturing the same
IBIDEN CO LTD25 citations93
US7732732B2Jun 8, 2010
Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
IBIDEN CO LTD9 citations84
US7462802B2Dec 9, 2008
Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
IBIDEN CO LTD12 citations84
US7462801B1Dec 9, 2008
Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
IBIDEN CO LTD10 citations84
US7084376B2Aug 1, 2006
Semiconductor production device ceramic plate
IBIDEN CO LTD13 citations84
US7078655B1Jul 18, 2006
Ceramic substrate, ceramic heater, electrostatic chuck and wafer prober for use in semiconductor producing and inspecting devices
IBIDEN CO LTD14 citations84
US7015166B2Mar 21, 2006
Carbon-containing aluminum nitride sintered compact and ceramic substrate for use in equipment for manufacturing or inspecting semiconductor
IBIDEN CO LTD11 citations84
US7011874B2Mar 14, 2006
Ceramic substrate for semiconductor production and inspection devices
IBIDEN CO LTD14 citations84
US6956186B1Oct 18, 2005
Ceramic heater
IBIDEN CO LTD17 citations84
US6878907B2Apr 12, 2005
Ceramic substrate and process for producing the same
IBIDEN CO LTD12 citations84
US6835916B2Dec 28, 2004
Ceramic heater
IBIDEN CO LTD17 citations84
US6809299B2Oct 26, 2004
Hot plate for semiconductor manufacture and testing
IBIDEN CO LTD15 citations84
US7721427B2May 25, 2010
Method for manufacturing single sided substrate
IBIDEN CO LTD6 citations74
US7385146B2Jun 10, 2008
Printed wiring board and method for manufacturing the same
IBIDEN CO LTD6 citations74
US7375289B2May 20, 2008
Multi-layer printed wiring board including an alignment mark as an index for a position of via holes
IBIDEN CO LTD6 citations74
US6936343B1Aug 30, 2005
Ceramic substrate
IBIDEN CO LTD7 citations74
US6888236B2May 3, 2005
Ceramic substrate for manufacture/inspection of semiconductor
IBIDEN CO LTD10 citations74
US6887316B2May 3, 2005
Ceramic heater
IBIDEN CO LTD10 citations74
US6861165B2Mar 1, 2005
Aluminum nitride sintered compact, ceramic substrate, ceramic heater and electrostatic chuck
IBIDEN CO LTD11 citations74
US6861620B2Mar 1, 2005
Ceramic heater
IBIDEN CO LTD4 citations74
US6825555B2Nov 30, 2004
Hot plate
IBIDEN CO LTD10 citations74
US7615162B2Nov 10, 2009
Printed wiring board and method for manufacturing the same
IBIDEN CO LTD3 citations73
US7667160B2Feb 23, 2010
Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
IBIDEN CO LTD3 citations63
ISHIKAWA GASKET
1 patentASAI MOTOO
1 patentShowing the top 50 of 55 patents by PatentIndex Score.