Inventor
COURNOYER MARYSE
CA7 patents
Patents
7 patentsUS10784202B2Sep 22, 2020
High-density chip-to-chip interconnection with silicon bridge
IBM33 citations89
US11209598B2Dec 28, 2021
Photonics package with face-to-face bonding
IBM11 citations82
US10991635B2Apr 27, 2021
Multiple chip bridge connector
IBM2 citations72
US10580738B2Mar 3, 2020
Direct bonded heterogeneous integration packaging structures
IBM4 citations71
US11177217B2Nov 16, 2021
Direct bonded heterogeneous integration packaging structures
IBM0 citations61
US11791270B2Oct 17, 2023
Direct bonded heterogeneous integration silicon bridge
IBM0 citations60
US11139269B2Oct 5, 2021
Mixed under bump metallurgy (UBM) interconnect bridge structure
IBM0 citations50