Inventor
KOMATSU SHINGO
JP28 patents
⚠️ This page may combine multiple inventors who share the name “KOMATSU SHINGO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD
15 patentsUS6784530B2Aug 31, 2004
Circuit component built-in module with embedded semiconductor chip and method of manufacturing
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD169 citations99
US6734542B2May 11, 2004
Component built-in module and method for producing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD347 citations99
US7294587B2Nov 13, 2007
Component built-in module and method for producing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD64 citations98
US7018866B2Mar 28, 2006
Circuit component built-in module with embedded semiconductor chip and method of manufacturing
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD83 citations98
US6975516B2Dec 13, 2005
Component built-in module and method for producing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD110 citations98
US6871396B2Mar 29, 2005
Transfer material for wiring substrate
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD69 citations98
US6489685B2Dec 3, 2002
Component built-in module and method of manufacturing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD111 citations98
US6939738B2Sep 6, 2005
Component built-in module and method for producing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD56 citations96
US6855892B2Feb 15, 2005
Insulation sheet, multi-layer wiring substrate and production processes thereof
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD62 citations96
US7198996B2Apr 3, 2007
Component built-in module and method for producing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD31 citations93
US6955948B2Oct 18, 2005
Method of manufacturing a component built-in module
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD33 citations93
US6936774B2Aug 30, 2005
Wiring substrate produced by transfer material method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD17 citations93
US7157789B2Jan 2, 2007
Semiconductor device and method for manufacturing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD7 citations74
US7390692B2Jun 24, 2008
Semiconductor device and method for manufacturing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD0 citations52
US7132756B2Nov 7, 2006
Semiconductor device and method for manufacturing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD1 citations52
PANASONIC CORP
9 patentsUS7611040B2Nov 3, 2009
Method for forming solder bump and method for mounting semiconductor device using a solder powder resin composition
PANASONIC CORP13 citations84
US8039307B2Oct 18, 2011
Mounted body and method for manufacturing the same
PANASONIC CORP2 citations63
US7921551B2Apr 12, 2011
Electronic component mounting method
PANASONIC CORP4 citations63
US7911064B2Mar 22, 2011
Mounted body and method for manufacturing the same
PANASONIC CORP4 citations63
US7888789B2Feb 15, 2011
Transfer material used for producing a wiring substrate
PANASONIC CORP2 citations63
US7713787B2May 11, 2010
Mounted body and method for manufacturing the same
PANASONIC CORP4 citations63
US7977741B2Jul 12, 2011
Manufacturing method of flexible semiconductor device and flexible semiconductor device
PANASONIC CORP0 citations52
US7851281B2Dec 14, 2010
Manufacturing method of flexible semiconductor device and flexible semiconductor device
PANASONIC CORP0 citations52
US8344264B2Jan 1, 2013
Semiconductor device and manufacturing process thereof
PANASONIC CORP0 citations51