Inventor

YAMASHITA YOSHIHISA

JP85 patents

⚠️ This page may combine multiple inventors who share the name “YAMASHITA YOSHIHISA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YAMASHITA YOSHIHISA

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Transfer material for wiring substrate

Method of manufacturing a thermally conductive circuit board with a ground pattern connected to a heat sink

Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein

Electronic component built-in module and method of manufacturing the same

Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same

Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same

Power module and method of manufacturing the same

Thermal conductive substrate and semiconductor module using the same

Wiring substrate produced by transfer material method

Power module and method of manufacturing the same

Method for manufacturing circuit board and circuit board and power conversion module using the same

Thermal conductive substrate and the method for manufacturing the same

Flexible substrate having interlaminar junctions, and process for producing the same

Circuit substrate having improved connection reliability and a method for manufacturing the same

Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink

Thermally conductive substrate, thermally conductive substrate manufacturing method and power module

Lead frame and production process thereof and production process of thermally conductive substrate

Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production

PANASONIC CORP

Magnetic sheet with stripe-arranged magnetic grains, RFID magnetic sheet, magnetic shielding sheet and method of manufacturing the same

Process for forming bumps and solder bump

Flexible substrate, multilayer flexible substrate

Flip chip mounting process and flip chip assembly

Method for forming solder bump and method for mounting semiconductor device using a solder powder resin composition

Flexible substrate having interlaminar junctions, and process for producing the same

Built-up substrate, method for manufacturing same, and semiconductor integrated circuit package

Mounted body and method for manufacturing the same

Flip chip mounting method and bump forming method

Electronic component mounting method

Mounted body and method for manufacturing the same

Transfer material used for producing a wiring substrate

Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body

Mounted body and method for manufacturing the same

CANON KK

Color filter manufacturing method, color filter manufactured by the method, and liquid crystal device employing the color filter

Aqueous dispersion of water-insoluble-colorant-containing particle and preparation process thereof, water-insoluble-colorant-containing particle and preparation process thereof, and ink

Liquid crystal elemental device, production process thereof and spacer-bearing substrate

Ink, color filter, liquid crystal panel, and computer, and process for producing color filter

Method for forming spacers, manufacturing method for a color filter having the spacers, and liquid crystal element formed by using the manufacturing method

Ink for use in ink jet recording and ink jet recording method utilizing the same

Ink, color filter, liquid crystal panel, and computer, and process for producing color filter

Ink jet recording apparatus and ink jet recording method

Ink set, ink jet recording method, ink cartridge, recording unit, and ink jet recording apparatus

Ink-jet recording method, ink-jet ink, ink-jet recording unit, ink cartridge for ink-jet recording and ink-jet recording apparatus

Ink-jet recording method, ink-jet ink, ink-jet recording unit, ink cartridge for ink-jet recording and ink-jet recording apparatus

Ink-jet recording method, ink-jet ink, ink-jet recording unit, ink cartridge for ink-jet recording and ink-jet recording apparatus

Ink-jet recording method, ink-jet ink, ink-jet recording unit, ink cartridge for ink-jet recording and ink-jet recording apparatus

PANASONIC IP MAN CO LTD

Electronic component package and method for manufacturing same

Electronic component package and method for manufacturing the same

Electronic component package and method for manufacturing same

Transparent electrode and method for manufacturing the same

SUZUKI KATSUHIKO

Ink jet recording method, and ink jet recording apparatus