Inventor

TAO SU

TW77 patents

⚠️ This page may combine multiple inventors who share the name “TAO SU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAO SU

ADVANCED SEMICONDUCTOR ENG

Semiconductor package and method for manufacturing the same

Thermal enhance MCM package and manufacturing method thereof

Method of making stacked chip package

Multichip module having a stacked chip arrangement

Multichip module having a stacked chip arrangement

Ball grid array semiconductor package having improved heat dissipation efficiency, overall electrical performance and enhanced bonding capability

Multichip modules and manufacturing method therefor

Thermally enhanced BGA package

Multichip module having a stacked chip arrangement

Semiconductor package with wire protection and method therefor

Stacked chip assembly utilizing a lead frame

Ball grid assembly type semiconductor package having improved chip edge support to prevent chip cracking

Micromachine package and method for manufacturing the same

Method of making a semiconductor package by dicing a wafer from the backside surface thereof

Multi-chip package structure

Optical component package and packaging including an optical component horizontally attached to a substrate

Bump and fabricating process thereof

Water-level package with bump ring

Wafer-level package with a cavity and fabricating method thereof

Under-ball-metallurgy layer

Microsystem package structure

Multichip wafer-level package and method for manufacturing the same

Optical integrated circuit element package and process for making the same

Solder paste for fabricating bump

Bump fabrication process

Structure of a solder mask for the circuit module of a BGA substrate

Substrate structure of BGA semiconductor package

Method of making a low-profile wire connection for stacked dies

Flip-chip semiconductor device with enhanced reliability and manufacturing efficiency, and the method for under filling the same

Semiconductor chip package and manufacturing method thereof

Ball grid array semiconductor package with improved strength and electric performance and method for making the same

Sucker for transferring packaged semiconductor device

Semiconductor package having a heat spreader capable of preventing being soldered and enhancing adhesion and electrical performance

Multi-chip package structure

Wafer level package structure with a heat slug

Process for fabricating wafer bumps

Lead-free bump fabrication process

Chip scale package

Method of making low-profile wire connection

Semiconductor package

Semiconductor wafer and testing method for the same

Multi-chip package structure

Quad flat non-leaded package

Semiconductor package and method for manufacturing the same

Solder ball attaching process

Bump fabrication method

Semiconductor package

IND TECH RES INST

Axial sealing mechanism of volute compressor

Back-pressure sealing system for revolving compressor

ADVANCED SEMICONDCUTOR ENGINEE

Multichip module