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Inventor

YU JICK

US9 patents
⚠️ This page may combine multiple inventors who share the name “YU JICK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

5 patents
US7049226B2May 23, 2006

Integration of ALD tantalum nitride for copper metallization

APPLIED MATERIALS INC514 citations98
US6936906B2Aug 30, 2005

Integration of barrier layer and seed layer

APPLIED MATERIALS INC56 citations96
US7494908B2Feb 24, 2009

Apparatus for integration of barrier layer and seed layer

APPLIED MATERIALS INC12 citations84
US7352048B2Apr 1, 2008

Integration of barrier layer and seed layer

APPLIED MATERIALS INC11 citations84
US7704887B2Apr 27, 2010

Remote plasma pre-clean with low hydrogen pressure

APPLIED MATERIALS INC10 citations83

INTEL CORP

2 patents
US6365514B1Apr 2, 2002

Two chamber metal reflow process

INTEL CORP11 citations72
US6746727B1Jun 8, 2004

Metal to ILD adhesion improvement by reactive sputtering

INTEL CORP0 citations50

CHUNG HUA

1 patent
US8324095B2Dec 4, 2012

Integration of ALD tantalum nitride for copper metallization

CHUNG HUA18 citations91

TANG XIANMIN

1 patent
US8557094B2Oct 15, 2013

Sputtering chamber having auxiliary backside magnet to improve etch uniformity and magnetron producing sustained self sputtering of ruthenium and tantalum

TANG XIANMIN1 citations46