Inventor
YANG WEN-PIN
TW29 patents
⚠️ This page may combine multiple inventors who share the name “YANG WEN-PIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
BRISTOL MYERS SQUIBB CO
12 patentsUS5571708ANov 5, 1996
Thrombin-activatable plasminogen activator
BRISTOL MYERS SQUIBB CO25 citations88
US7795392B2Sep 14, 2010
Organic anion transport proteins
BRISTOL MYERS SQUIBB CO12 citations81
US6403360B1Jun 11, 2002
KCNQ potassium channels and methods of modulating same
BRISTOL MYERS SQUIBB CO10 citations71
US6692934B1Feb 17, 2004
Organic anion transport proteins
BRISTOL MYERS SQUIBB CO11 citations70
US7235375B2Jun 26, 2007
Organic anion transport proteins
BRISTOL MYERS SQUIBB CO8 citations69
US7101686B1Sep 5, 2006
Polynucleotides encoding human SLAP-2:a novel SH2/SH3 domain-containing human SLAP homologue having immune cell-specific expression
BRISTOL MYERS SQUIBB CO2 citations61
US7482431B2Jan 27, 2009
KCNQ2 potassium channels
BRISTOL MYERS SQUIBB CO2 citations60
US7262289B2Aug 28, 2007
KCNQ potassium channels and methods of modulating same
BRISTOL MYERS SQUIBB CO2 citations60
US7667003B2Feb 23, 2010
Antibody directed to human mist (mast cell immunoreceptor signal transducer)
BRISTOL MYERS SQUIBB CO0 citations51
US7517957B2Apr 14, 2009
Human SLAP-2: a novel SH2/ SH3 domain-containing human SLAP homologue having immune cell-specific expression
BRISTOL MYERS SQUIBB CO0 citations51
US7442770B2Oct 28, 2008
Human clnk-related polypeptide, MIST (Mast Cell Immunoreceptor Signal Transducer)
BRISTOL MYERS SQUIBB CO0 citations51
US7241590B2Jul 10, 2007
Identification and cloning of a full-length human Clnk-related gene, MIST (mast cell immunoreceptor signal transducer)
BRISTOL MYERS SQUIBB CO0 citations51
ADVANCED CHIP ENG TECH INC
6 patentsUS7667318B2Feb 23, 2010
Fan out type wafer level package structure and method of the same
ADVANCED CHIP ENG TECH INC56 citations97
US7061106B2Jun 13, 2006
Structure of image sensor module and a method for manufacturing of wafer level package
ADVANCED CHIP ENG TECH INC55 citations96
US7557437B2Jul 7, 2009
Fan out type wafer level package structure and method of the same
ADVANCED CHIP ENG TECH INC25 citations92
US7501310B2Mar 10, 2009
Structure of image sensor module and method for manufacturing of wafer level package
ADVANCED CHIP ENG TECH INC33 citations92
US7985626B2Jul 26, 2011
Manufacturing tool for wafer level package and method of placing dies
ADVANCED CHIP ENG TECH INC0 citations52
US7498646B2Mar 3, 2009
Structure of image sensor module and a method for manufacturing of wafer level package
ADVANCED CHIP ENG TECH INC1 citations52
YANG WEN-KUN
3 patentsUS7196408B2Mar 27, 2007
Fan out type wafer level package structure and method of the same
YANG WEN-KUN84 citations97
US7459781B2Dec 2, 2008
Fan out type wafer level package structure and method of the same
YANG WEN-KUN52 citations96
US7262081B2Aug 28, 2007
Fan out type wafer level package structure and method of the same
YANG WEN-KUN55 citations96