Manufacturing tool for wafer level package and method of placing dies

Abstract

A manufacturing method of placing dice for a wafer level package comprises placing a plurality of dice on an elastic material, which is formed on a first base, and the elastic material of the present invention has viscosity in a first condition to adhere the plurality of dice; forming an adhesive material on a second base; adhering the plurality of dice on the adhesive material of the second base; and stripping the plurality of dice from the elastic material in a second condition.

1. A placing method of die for wafer level package, comprising:
 placing a plurality of dice on an elastic material by using a pick and place system, said elastic material formed on a first base, said elastic material having a viscosity in a first condition to adhere said plurality of dice; 
 forming an adhesive material on a second base; 
 adhering said plurality of dice on said adhesive material of said second base; 
 reducing the viscosity of the elastic material so that the elastic material is in a second condition; and 
 stripping said plurality of dice adhered by said viscosity from said elastic material in solvent or UV light condition whereby substantially eliminating said viscosity of said elastic material without dissolving said elastic material. 
 
     
     
       2. The method in  claim 1 , wherein the material of said first base is silicon, glass, quartz or ceramic. 
     
     
       3. The method in  claim 1 , wherein the material of said second base is silicon, glass, quartz, ceramic or PCB. 
     
     
       4. The method in  claim 1 , wherein said second base is lead frame. 
     
     
       5. The method in  claim 1 , wherein material of said elastic material is silicon resin, elastic PU, porous PU, acrylic rubber or die sawing tape (Blue tape/UV tape). 
     
     
       6. The method in  claim 1 , wherein said elastic material is formed on a surface of said first base by spin coating, printing or adhering. 
     
     
       7. The method in  claim 1 , wherein said adhesive material is formed on a surface of said second base by spin coating or printing. 
     
     
       8. The method in  claim 1 , wherein said plurality of dice are fixed on said elastic material with a bottom surface exposed. 
     
     
       9. The method in  claim 1 , further comprising a step of UV curing or heat curing after adhering.